GS81302Q37AGD-450I
Manufacturer No:
GS81302Q37AGD-450I
Manufacturer:
Description:
IC SRAM 144MBIT PAR 165FPBGA
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In Stock : 0
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GS81302Q37AGD-450I Specifications
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TypeParameter
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Access Time-
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Supplier Device Package165-FPBGA (13x15)
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Package / Case165-LBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 100°C (TJ)
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Voltage - Supply1.7V ~ 1.9V
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Write Cycle Time - Word, Page-
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Clock Frequency450 MHz
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Memory InterfaceParallel
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Memory Organization4M x 36
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Memory Size144Mbit
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TechnologySRAM - Quad Port, Synchronous, QDR II+
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Memory FormatSRAM
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Memory TypeVolatile
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series-
The GS81302Q37AGD-450I integrated circuit chip is designed for high-speed data transmission in optical communication systems. It has several advantages and application scenarios:Advantages:1. High-speed Data Transmission: The chip supports data transmission rates up to 100 Gbps, enabling faster communication between different points.2. Low Power Consumption: It is built with efficient power management techniques, allowing it to operate with low power consumption, making it suitable for battery-powered devices or energy-conscious systems.3. Small Size: The chip is compact in size, making it suitable for integration into small-sized devices or systems where space is a constraint.4. High Reliability: It is designed to operate reliably under various conditions, ensuring stable data transmission without compromising the integrity of the signals.Application Scenarios:1. Optical Communication Systems: The GS81302Q37AGD-450I chip is primarily used in optical communication systems, such as fiber-optic networks and data centers, where high-speed data transmission is necessary.2. Telecommunication Equipment: It can be integrated into telecommunication equipment like routers, switches, and optical transceivers to enable fast and reliable data transfer.3. High-Performance Computing: The chip can be utilized in high-performance computing systems like supercomputers or cloud computing infrastructure to enhance data transfer speeds between various components.4. Data Centers: It can be used in data centers to enable efficient and high-speed communication between servers, storage systems, and networking equipment.5. Internet of Things (IoT) Devices: The chip can be integrated into IoT devices like smart meters, industrial sensors, or surveillance systems, where high-speed data transmission is required.Overall, the GS81302Q37AGD-450I chip offers advantages in terms of high-speed data transmission, low power consumption, small size, and reliability. Its application scenarios range from optical communication systems to telecommunication equipment, high-performance computing, data centers, and IoT devices.
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