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GS81302Q18AGD-300I

GS81302Q18AGD-300I

Manufacturer No:

GS81302Q18AGD-300I

Manufacturer:

GSI Technology Inc.

Description:

IC SRAM 144MBIT PAR 165FPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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GS81302Q18AGD-300I Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    165-FPBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    300 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    8M x 18
  • Memory Size
    144Mbit
  • Technology
    SRAM - Quad Port, Synchronous, QDR II
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The GS81302Q18AGD-300I integrated circuit chips have several advantages and application scenarios, such as:Advantages: 1. High-speed Data Transfer: The GS81302Q18AGD-300I chips provide high-speed data transfer capabilities, making them suitable for applications requiring high bandwidth communication. 2. Low Power Consumption: These chips are designed to consume low power, making them energy-efficient and ideal for battery-powered devices or applications where power efficiency is crucial. 3. Small Form Factor: The GS81302Q18AGD-300I chips are compact in size, enabling their usage in space-constrained applications. 4. Robust Performance: These chips offer robust performance, ensuring reliable and error-free data transmission.Application Scenarios: 1. Data Centers: The high-speed data transfer capabilities of these chips make them suitable for use in data centers where fast and reliable communication is essential for server-to-server or storage area network connectivity. 2. Network Equipment: The GS81302Q18AGD-300I chips can be used in network switches and routers to enable high-speed and low-latency data communication between various network devices, enhancing network performance. 3. Telecommunications: These chips can be utilized in telecommunications equipment to improve the data transfer capabilities of network infrastructure, enabling faster and more efficient communication between devices. 4. Automotive Electronics: Due to their low power consumption and small form factor, these chips can be employed in automotive electronics applications like infotainment systems, communication modules, or advanced driver-assistance systems (ADAS). 5. Industrial Automation: The robust performance and high-speed capabilities of these chips are well-suited for industrial automation systems, enabling fast and reliable communication between different automated machinery or control systems.Overall, the GS81302Q18AGD-300I integrated circuit chips offer advantages of high-speed data transfer, low power consumption, and small form factor. These qualities make them suitable for various applications ranging from data centers and network equipment to automotive electronics and industrial automation.
GS81302Q18AGD-300I Relevant information