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GS81302DT20GE-500I

GS81302DT20GE-500I

Manufacturer No:

GS81302DT20GE-500I

Manufacturer:

GSI Technology Inc.

Description:

IC SRAM 144MBIT PAR 165FPBGA

Datasheet:

Datasheet

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GS81302DT20GE-500I Specifications

  • Type
    Parameter
  • Supplier Device Package
    165-FPBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    500 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    8M x 18
  • Memory Size
    144Mbit
  • Technology
    SRAM - Quad Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The GS81302DT20GE-500I integrated circuit chips, manufactured by GSI Technology, have several advantages and application scenarios:1. High Speed and Low Latency: This chip is designed for high-speed data processing with low latency, making it suitable for applications that require real-time processing and quick response times.2. Dual-Port Interface: The chip features a dual-port interface, allowing simultaneous access to memory from multiple sources. This makes it ideal for networking applications, such as switches, routers, and network processors.3. High Density Memory: With a footprint of 20Gb, this chip provides high-density memory capacity. It is suitable for applications that require large amounts of data storage, such as data centers, cloud computing, and high-performance computing.4. Energy Efficiency: The GS81302DT20GE-500I chip is designed with low power consumption, making it suitable for battery-powered devices or applications that require energy-efficient components.5. Reliability and Error Correction: The chip incorporates error correction features that enhance data integrity and reliability. It is well-suited for applications that require high data integrity, such as aerospace, defense, and industrial systems.6. Scalability: The chips can be easily integrated into high-density memory configurations due to their scalability. This makes them ideal for large-scale computing environments that require expansion and upgrading options.Application Scenarios:1. Networking Equipment: The dual-port interface and high-speed processing capabilities of the GS81302DT20GE-500I make it suitable for networking equipment such as switches, routers, and network processors. It enables efficient data transfer and processing in these devices.2. Data Centers: The high-density memory capacity of the chip allows for efficient storage and retrieval of large amounts of data in data centers. It can be used in servers, storage systems, and high-performance computing applications.3. Communication Systems: The chip's low latency and high-speed processing make it suitable for communication systems that require real-time data processing, such as telecommunications infrastructure and mobile base stations.4. Industrial Control Systems: The reliability and error correction features of the chip make it suitable for industrial control systems that require high data integrity, such as manufacturing automation, robotics, and process control.5. Aerospace and Defense: The error correction capabilities and reliability of the chip make it suitable for aerospace and defense applications, such as avionics, radar systems, and secure communication systems.6. AI and Machine Learning: The high-speed processing capabilities of the chip can be leveraged in AI and machine learning applications that require quick data processing, such as real-time pattern recognition and predictive analytics.Overall, the GS81302DT20GE-500I integrated circuit chips have various advantages and can be applied in several scenarios, ranging from networking and data centers to industrial control systems and aerospace/defense applications.
GS81302DT20GE-500I Relevant information