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70V7519S166BF

70V7519S166BF

Manufacturer No:

70V7519S166BF

Description:

IC SRAM 9MBIT PARALLEL 208CABGA

Datasheet:

Datasheet

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70V7519S166BF Specifications

  • Type
    Parameter
  • Clock Frequency
    166 MHz
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    3.6 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 36
  • Memory Size
    9Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The 70V7519S166BF integrated circuit (IC) chip is specifically designed for memory applications, particularly in the telecommunications industry. Some of its advantages and application scenarios include:Advantages: 1. High-speed performance: The 70V7519S166BF IC chip operates at high speeds, enabling efficient data storage and retrieval. 2. Large capacity: It has a large memory capacity, allowing for storage of a significant amount of data. 3. Low power consumption: The chip is designed to consume low power, making it suitable for power-sensitive applications and reducing energy costs. 4. High reliability: It offers robust and reliable performance, ensuring data integrity and reducing the risk of errors or data loss. 5. Flexible interface: The IC chip supports a variety of industry-standard interfaces, making it compatible with a wide range of systems.Application Scenarios: 1. Telecommunication systems: The 70V7519S166BF IC chip is commonly used in telecommunications equipment, such as routers, switches, and base stations. It provides high-speed memory for efficient data processing and network operations. 2. Networking devices: It is also suitable for various networking devices, including data centers, servers, and storage systems. The chip's large capacity and reliable performance support data-intensive applications and high-bandwidth requirements. 3. Embedded systems: The IC chip finds application in embedded systems, such as industrial control systems, Internet of Things (IoT) devices, and automotive electronics. Its low power consumption and high reliability make it ideal for these applications. 4. Computing and servers: The chip can be utilized in computing systems and servers that require high-speed and large-capacity memory for efficient operations. It enhances system performance and contributes to faster data processing. 5. Communication infrastructure: The 70V7519S166BF IC chip is often employed in communication infrastructure equipment, including base transceiver stations (BTS), optical networking devices, and microwave communication systems. It enables the storage and retrieval of data in these critical systems.Overall, the 70V7519S166BF IC chip offers high-speed, high-capacity memory with low power consumption, making it well-suited for various memory-intensive applications in the telecommunications and networking industries.
70V7519S166BF Relevant information