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CY7C1562XV18-450BZXC

CY7C1562XV18-450BZXC

Manufacturer No:

CY7C1562XV18-450BZXC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C1562XV18-450BZXC Specifications

  • Type
    Parameter
  • Clock Frequency
    450 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 18
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, QDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C1562XV18-450BZXC is a specific integrated circuit chip from Cypress Semiconductor. This chip belongs to the family of Ultra-Low-Power (ULP) SRAMs and is designed for specialized applications. Some of the advantages and application scenarios of this chip are:1. Low Power Consumption: The ULP design of this chip ensures low power consumption, making it suitable for battery-powered devices and other power-sensitive applications.2. High Density: The CY7C1562XV18-450BZXC chip offers a high density of memory, typically 18 Megabits (Mbit) or 2.25 Megabytes (MB), allowing for storage of substantial data.3. Fast Operating Speed: With an access time of 36 nanoseconds (ns), this chip offers fast read and write operations, making it ideal for applications that require quick data access.4. Industrial Temperature Range: The chip operates within an extended industrial temperature range of -40°C to 125°C, making it suitable for applications in harsh environments.5. Application-Specific Integrated Circuit (ASIC) Integration: The CY7C1562XV18-450BZXC chip is designed for integration into ASICs, which allows for customization and optimization of its functionality for specific applications.Some of the application scenarios where the CY7C1562XV18-450BZXC chip can be utilized include:1. Internet of Things (IoT) Devices: With its low power consumption and high density, this chip can be used in IoT devices that require memory for data storage and processing.2. Wearable Devices: The ULP design of this chip makes it suitable for integration into wearable devices, such as smartwatches and fitness trackers, where power efficiency is crucial.3. Automotive Electronics: With the ability to operate in an extended temperature range and high density for data storage, this chip can be used in automotive electronic systems, like infotainment systems or advanced driver-assistance systems (ADAS).4. Medical Devices: The low power consumption and high density make this chip suitable for medical devices that require memory for data storage and processing, such as patient monitoring systems or portable medical equipment.Overall, the CY7C1562XV18-450BZXC integrated circuit chip offers low power consumption, high density, and fast operation, making it suitable for a range of applications, especially those requiring memory storage with power efficiency and customization.
CY7C1562XV18-450BZXC Relevant information