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70T3319S133BF

70T3319S133BF

Manufacturer No:

70T3319S133BF

Description:

IC SRAM 4.5MBIT PAR 208CABGA

Datasheet:

Datasheet

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70T3319S133BF Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    2.4V ~ 2.6V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    133 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 18
  • Memory Size
    4.5Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The 70T3319S133BF integrated circuit chips offer several advantages and can be applied in various scenarios. Here are some of the key advantages and application scenarios:Advantages: 1. High Performance: The 70T3319S133BF chips are designed to deliver high performance in terms of speed, efficiency, and processing power. 2. Versatility: These chips are versatile and can be used in multiple applications across different industries. 3. Integrated Features: The chips come with integrated features like memory, logic, and data management capabilities, reducing the need for additional components. 4. Power Efficiency: The 70T3319S133BF chips are engineered to be power-efficient, reducing overall energy consumption. 5. Reliability: These chips are designed for reliability, ensuring consistent and stable performance over an extended period of time.Application Scenarios: 1. Aerospace and Defense: The high performance and reliability of these chips make them suitable for applications in aerospace and defense systems such as radar systems, satellites, and avionics. 2. Telecommunications: The chips can be used in telecommunications equipment like routers, switches, and network appliances to enable high-speed data processing and efficient communication. 3. Industrial Automation: These chips find applications in industrial automation systems, providing real-time data processing, control, and monitoring capabilities for manufacturing processes. 4. Automotive Electronics: The chips can be utilized in automotive electronic systems, including advanced driver-assistance systems (ADAS), engine control units (ECUs), and infotainment systems, offering enhanced performance and functionality. 5. Medical Devices: The high reliability and power efficiency of these chips make them suitable for medical devices like diagnostic equipment, patient monitoring systems, and imaging devices. 6. Internet of Things (IoT): The chips can be used in IoT devices and edge computing systems, enabling efficient data processing and connectivity in smart homes, cities, and industrial IoT applications.It is essential to note that the application scenarios may vary depending on the specific requirements and capabilities of the 70T3319S133BF chips.
70T3319S133BF Relevant information