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70T3319S133BC

70T3319S133BC

Manufacturer No:

70T3319S133BC

Description:

IC SRAM 4.5MBIT PAR 256CABGA

Datasheet:

Datasheet

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70T3319S133BC Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-CABGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    2.4V ~ 2.6V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    133 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 18
  • Memory Size
    4.5Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The 70T3319S133BC integrated circuit (IC) chips are part of the DDR4 SDRAM modules primarily designed for computer memory applications. Here are some advantages and application scenarios of these IC chips:Advantages: 1. Increased Data Transfer Speed: The 70T3319S133BC IC chips are designed to support DDR4 memory technology, which provides faster data transfer rates compared to previous generations. It allows for higher bandwidth and faster processing, leading to improved overall system performance.2. Higher Memory Capacity: DDR4 technology supports higher memory densities, allowing for larger memory capacities. This enables systems to handle more complex tasks, such as running high-performance applications or virtual machines.3. Improved Power Efficiency: DDR4 memory modules operate at lower voltage levels compared to their predecessors. The 70T3319S133BC IC chips are designed to be power-efficient, reducing energy consumption and heat dissipation in computer systems.4. Better System Stability: With advanced error correction mechanisms, DDR4 memory technology provides improved data reliability and integrity. The 70T3319S133BC IC chips incorporate such mechanisms, enhancing system stability and reducing the likelihood of data corruption or crashes.Application Scenarios: 1. Servers and Data Centers: The high memory capacity and increased data transfer speeds offered by the 70T3319S133BC IC chips make them suitable for server and data center applications. These chips enable efficient handling of heavy workloads, such as running virtual machines, databases, or cloud services.2. High-End Gaming PCs: Gaming requires high-performance systems capable of running demanding games and supporting real-time rendering. The 70T3319S133BC IC chips' faster data transfer rates and higher memory capacities make them ideal for gaming PCs, enhancing the gaming experience with improved speed and responsiveness.3. Workstations and Professional Applications: Complex computing tasks, such as video editing, 3D modeling, or scientific simulations, often require systems with substantial memory capacities and high-speed data processing. The 70T3319S133BC IC chips facilitate smooth multitasking and quick data access for such professional applications.4. Networking and Telecommunications: The 70T3319S133BC IC chips' power efficiency and stability make them suitable for networking and telecommunications equipment where reliable and efficient data handling is critical, such as routers, switches, or base stations.Overall, the 70T3319S133BC IC chips are well-suited for applications that demand high-performance memory solutions with increased data transfer rates, larger memory capacities, improved power efficiency, and enhanced system stability.
70T3319S133BC Relevant information