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70V659S12BFI8

70V659S12BFI8

Manufacturer No:

70V659S12BFI8

Description:

IC SRAM 4.5MBIT PAR 208CABGA

Datasheet:

Datasheet

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70V659S12BFI8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    12 ns
  • Write Cycle Time - Word, Page
    12ns
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 36
  • Memory Size
    4.5Mbit
  • Technology
    SRAM - Dual Port, Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70V659S12BFI8 integrated circuit (IC) chip is a specific model that I am not familiar with, as my training data only goes up until March 2023. However, I can provide you with some general information about IC chips and their advantages and application scenarios.Integrated circuit chips are miniature electronic circuits that are fabricated onto a small semiconductor material, typically silicon. They contain a combination of transistors, resistors, capacitors, and other electronic components, all integrated onto a single chip. IC chips offer several advantages over discrete electronic components:1. Size and Space Efficiency: IC chips allow for the integration of multiple components onto a single chip, reducing the overall size and complexity of electronic devices. This makes them ideal for applications where space is limited, such as in portable devices or densely packed electronic systems.2. Power Efficiency: IC chips are designed to be power-efficient, allowing electronic devices to operate for longer periods on limited power sources, such as batteries. This is particularly important for portable devices and energy-conscious applications.3. Reliability: The integration of components onto a single chip reduces the number of interconnections and solder joints, minimizing the risk of failure due to loose connections or environmental factors. IC chips are generally more reliable than discrete components.4. Cost-Effectiveness: Mass production of IC chips results in lower manufacturing costs compared to discrete components. This makes IC chips more cost-effective for large-scale production of electronic devices.As for application scenarios, IC chips are used in a wide range of electronic devices and systems, including:1. Consumer Electronics: IC chips are found in smartphones, tablets, laptops, televisions, gaming consoles, and other consumer electronic devices.2. Automotive Electronics: IC chips are used in various automotive systems, such as engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and more.3. Industrial Control Systems: IC chips are employed in industrial automation, robotics, process control, and monitoring systems.4. Medical Devices: IC chips are used in medical equipment, such as patient monitoring systems, imaging devices, and implantable devices.5. Communication Systems: IC chips are utilized in telecommunications equipment, networking devices, and wireless communication systems.It's important to note that the specific advantages and application scenarios of the 70V659S12BFI8 IC chip may vary depending on its intended purpose and specifications. For detailed information about this particular chip, I recommend referring to the manufacturer's documentation or contacting the manufacturer directly.
70V659S12BFI8 Relevant information