S70GL02GS12FHIV23

S70GL02GS12FHIV23

Manufacturer No:

S70GL02GS12FHIV23

Manufacturer:

Infineon Technologies

Description:

IC FLASH 2GBIT PARALLEL 64FBGA

Datasheet:

Datasheet

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S70GL02GS12FHIV23 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-FBGA (13x11)
  • Package / Case
    64-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Access Time
    120 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    128M x 16
  • Memory Size
    2Gbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    GL-S
The S70GL02GS12FHIV23 is a specific type of integrated circuit (IC) chip manufactured by Cypress Semiconductor. It belongs to the range of NOR flash memory chips. The advantages and application scenarios of this chip are as follows:Advantages: 1. High Capacity: The S70GL02GS12FHIV23 chip offers a large storage capacity of 2 Gigabits (256 Megabytes). This makes it suitable for storing substantial amounts of data in various applications. 2. Fast Read/Write Speed: It supports fast read and write operations, enabling efficient data access and transmission. 3. Reliable Performance: The chip is designed for high reliability and endurance, making it suitable for demanding applications. 4. Low Power Consumption: It operates on low power, which helps in reducing power consumption and enhancing battery life in portable devices. 5. Wide Temperature Range: The chip can withstand a wide operating temperature range, from -40°C to 85°C, allowing it to be used in diverse environments.Application Scenarios: 1. Embedded Systems: The S70GL02GS12FHIV23 chip is widely used in embedded systems for storing firmware, boot code, or application code that needs to be accessed quickly and reliably. It finds applications in sectors like telecommunications, automotive, industrial control, and consumer electronics. 2. Networking Equipment: It can be used in routers, switches, and other network devices to store configuration data and firmware. 3. Internet of Things (IoT) Devices: The chip can be used in IoT devices such as smart home devices, wearables, and industrial IoT sensors for data storage. 4. Automotive Electronics: With its high capacity and reliability, the chip can be used in automotive applications like infotainment systems, advanced driver assistance systems (ADAS), and instrument clusters. 5. Medical Devices: The chip can be utilized in medical equipment for storing critical firmware or patient data securely.These are just a few examples of the application scenarios where the S70GL02GS12FHIV23 chip can be effectively employed. Its high capacity, reliability, and fast access speed make it suitable for various memory-intensive applications across multiple industries.