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70V659S10BFG8

70V659S10BFG8

Manufacturer No:

70V659S10BFG8

Description:

IC SRAM 4.5MBIT PAR 208CABGA

Datasheet:

Datasheet

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70V659S10BFG8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    10 ns
  • Write Cycle Time - Word, Page
    10ns
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 36
  • Memory Size
    4.5Mbit
  • Technology
    SRAM - Dual Port, Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70V659S10BFG8 is a specific integrated circuit (IC) chip manufactured by IDT (Integrated Device Technology). However, there is limited information available about this particular chip model. Without specific datasheets or technical documentation, it is difficult to provide detailed advantages and application scenarios for this chip. In general, IC chips are used in a wide range of electronic devices and applications, such as communication systems, consumer electronics, industrial automation, automotive systems, and more. Advantages of IC chips can vary depending on the specific chip's features, functionalities, and performance characteristics. Some potential advantages of IC chips in general could include:1. Compact size: IC chips are designed to pack a large number of electronic components and functionalities into a small form factor, making them ideal for applications with space constraints. 2. Power efficiency: Many IC chips are engineered to minimize power consumption, increasing the energy efficiency of the electronic device. 3. High performance: IC chips can offer high-speed processing, enhanced capabilities, and optimized performance for specific tasks or applications. 4. Integration: IC chips can integrate various components, functions, or modules onto a single chip, simplifying design complexity and reducing overall costs. 5. Reliability: IC chips are typically manufactured using advanced fabrication processes, ensuring high reliability, stability, and longevity.To fully understand the advantages and application scenarios of the 70V659S10BFG8 chip, it is recommended to refer to the official datasheet or technical documentation provided by IDT or contact their technical support for more specific information.
70V659S10BFG8 Relevant information