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70V3399S133BCI

70V3399S133BCI

Manufacturer No:

70V3399S133BCI

Description:

IC SRAM 2MBIT PARALLEL 256CABGA

Datasheet:

Datasheet

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70V3399S133BCI Specifications

  • Type
    Parameter
  • Clock Frequency
    133 MHz
  • Supplier Device Package
    256-CABGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 18
  • Memory Size
    2Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The 70V3399S133BCI integrated circuit (IC) chip is a specific component, and without detailed information about its specifications and intended use, it is challenging to provide a comprehensive analysis of its advantages and application scenarios. However, I can provide you with some general information about IC chips and their potential advantages and applications.Integrated circuit chips are miniature electronic circuits that contain various components, such as transistors, resistors, and capacitors, fabricated on a single semiconductor material. They offer several advantages over discrete electronic components, including smaller size, lower power consumption, improved reliability, and increased functionality.The specific advantages and application scenarios of the 70V3399S133BCI IC chip would depend on its intended purpose and features. IC chips can be found in a wide range of applications, including telecommunications, consumer electronics, automotive systems, medical devices, and industrial control systems.Some potential advantages of IC chips in general include:1. Miniaturization: IC chips allow for the integration of complex circuits into a small form factor, enabling the development of compact and portable devices.2. Power efficiency: IC chips are designed to operate at lower power levels, resulting in reduced energy consumption and longer battery life in portable devices.3. Reliability: The integration of components on a single chip reduces the number of interconnections, minimizing the risk of failure due to loose connections or environmental factors.4. Cost-effectiveness: Mass production of IC chips can lead to lower manufacturing costs compared to discrete components, making them more affordable for various applications.As for application scenarios, IC chips can be used in a wide range of electronic devices, such as:1. Mobile devices: IC chips are essential components in smartphones, tablets, and wearable devices, enabling functions like wireless communication, processing, and power management.2. Automotive systems: IC chips are used in various automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and electric vehicle powertrain control.3. Industrial control systems: IC chips play a crucial role in industrial automation, controlling processes, monitoring sensors, and enabling communication between different components.4. Medical devices: IC chips are used in medical equipment, such as pacemakers, implantable devices, diagnostic instruments, and monitoring systems.It's important to note that the specific advantages and application scenarios of the 70V3399S133BCI IC chip may vary, and it would be best to refer to the manufacturer's documentation or consult with experts in the field for detailed information about this particular chip.
70V3399S133BCI Relevant information