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70T3319S200BC8

70T3319S200BC8

Manufacturer No:

70T3319S200BC8

Description:

IC SRAM 4.5MBIT PAR 256CABGA

Datasheet:

Datasheet

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70T3319S200BC8 Specifications

  • Type
    Parameter
  • Clock Frequency
    200 MHz
  • Supplier Device Package
    256-CABGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    2.4V ~ 2.6V
  • Access Time
    3.4 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 18
  • Memory Size
    4.5Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70T3319S200BC8 integrated circuit (IC) chips are part of the Virtex-7 family of field-programmable gate arrays (FPGAs) manufactured by Xilinx. These chips offer several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the 70T3319S200BC8 IC chips are:Advantages: 1. High Performance: The Virtex-7 FPGAs, including the 70T3319S200BC8, offer high-performance capabilities with advanced features like high-speed serial connectivity, high logic capacity, and high-speed memory interfaces. This makes them suitable for demanding applications that require fast processing and data transfer.2. Flexibility: FPGAs are programmable devices, allowing users to configure the chip's functionality according to their specific requirements. The 70T3319S200BC8 IC chips can be programmed to implement custom logic functions, making them versatile for a wide range of applications.3. Power Efficiency: Xilinx's Virtex-7 FPGAs are designed to be power-efficient, providing high performance while minimizing power consumption. This is advantageous for applications where power efficiency is crucial, such as portable devices or energy-constrained environments.4. Scalability: The Virtex-7 FPGAs come in various sizes and configurations, including the 70T3319S200BC8 chip. This allows users to choose the appropriate chip based on their application's requirements, providing scalability and cost-effectiveness.Application Scenarios: 1. Communications and Networking: The high-speed serial connectivity and advanced signal processing capabilities of the 70T3319S200BC8 IC chips make them suitable for applications in telecommunications, networking, and data centers. They can be used for tasks like packet processing, encryption/decryption, protocol conversion, and high-speed data transmission.2. Aerospace and Defense: The Virtex-7 FPGAs, including the 70T3319S200BC8, are commonly used in aerospace and defense applications. They can be employed in radar systems, avionics, satellite communication, signal intelligence, and other mission-critical systems that require high-performance processing, real-time data analysis, and reliable operation in harsh environments.3. High-Performance Computing: The 70T3319S200BC8 IC chips can be utilized in high-performance computing (HPC) applications, such as scientific research, simulations, and data analytics. Their parallel processing capabilities and high-speed interfaces enable efficient computation and data handling, accelerating complex calculations and data-intensive tasks.4. Industrial Automation: FPGAs are widely used in industrial automation for tasks like control systems, machine vision, robotics, and real-time monitoring. The 70T3319S200BC8 chips can be employed in these applications to implement custom logic, interface with sensors and actuators, and process data in real-time.These are just a few examples of the advantages and application scenarios of the 70T3319S200BC8 IC chips. The versatility and high-performance capabilities of these chips make them suitable for a wide range of applications across various industries.
70T3319S200BC8 Relevant information