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70T3319S133BFGI8

70T3319S133BFGI8

Manufacturer No:

70T3319S133BFGI8

Description:

IC SRAM 4.5MBIT PAR 208CABGA

Datasheet:

Datasheet

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70T3319S133BFGI8 Specifications

  • Type
    Parameter
  • Clock Frequency
    133 MHz
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.4V ~ 2.6V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 18
  • Memory Size
    4.5Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70T3319S133BFGI8 integrated circuit (IC) chips are part of the Virtex-7 family of Field-Programmable Gate Arrays (FPGAs) manufactured by Xilinx. These chips offer several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the 70T3319S133BFGI8 IC chips are:Advantages: 1. High Performance: The Virtex-7 FPGAs, including the 70T3319S133BFGI8, offer high-performance capabilities with advanced features like high-speed serial connectivity, high logic capacity, and high-speed I/O interfaces. 2. Flexibility: Being FPGAs, these chips provide flexibility in terms of design and functionality. They can be programmed and reprogrammed to implement different logic functions and algorithms, making them suitable for a wide range of applications. 3. Integration: The 70T3319S133BFGI8 chips integrate multiple components and functionalities into a single device, reducing the need for external components and simplifying the overall system design. 4. Power Efficiency: Xilinx Virtex-7 FPGAs are designed to be power-efficient, allowing for optimized power consumption while delivering high-performance computing capabilities.Application Scenarios: 1. Communications and Networking: The high-speed serial connectivity and advanced I/O interfaces of the 70T3319S133BFGI8 chips make them suitable for applications in communications and networking systems. They can be used for implementing high-speed data transmission, protocol processing, network packet processing, and more. 2. Aerospace and Defense: The Virtex-7 FPGAs, including the 70T3319S133BFGI8, are commonly used in aerospace and defense applications. They can be utilized for radar and sonar signal processing, image and video processing, encryption and decryption, and other computationally intensive tasks. 3. High-Performance Computing: These chips find applications in high-performance computing systems, such as data centers and supercomputers. They can be used for accelerating complex algorithms, parallel processing, and implementing custom hardware accelerators. 4. Industrial Automation: The flexibility and integration capabilities of the 70T3319S133BFGI8 chips make them suitable for industrial automation applications. They can be used for implementing control systems, real-time data processing, machine vision, and robotics. 5. Medical Imaging: The high-performance computing capabilities of these chips make them suitable for medical imaging applications, such as ultrasound, MRI, and CT scanners. They can be used for real-time image processing, filtering, and analysis.These are just a few examples of the advantages and application scenarios of the 70T3319S133BFGI8 IC chips. The versatility and performance of these chips make them suitable for a wide range of applications in various industries.
70T3319S133BFGI8 Relevant information