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70V7519S133BF8

70V7519S133BF8

Manufacturer No:

70V7519S133BF8

Description:

IC SRAM 9MBIT PARALLEL 208CABGA

Datasheet:

Datasheet

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70V7519S133BF8 Specifications

  • Type
    Parameter
  • Access Time
    4.2 ns
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    133 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 36
  • Memory Size
    9Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70V7519S133BF8 integrated circuit (IC) chip is a specific model that I am not familiar with, as my training data only goes up until March 2023. However, I can provide you with some general information about IC chips and their advantages and application scenarios.Integrated circuit chips are miniature electronic circuits that are fabricated onto a small semiconductor material, typically silicon. They contain a combination of transistors, resistors, capacitors, and other electronic components, all integrated onto a single chip. IC chips offer several advantages over discrete electronic components:1. Size and Space Efficiency: IC chips allow for the integration of multiple components onto a single chip, reducing the overall size and complexity of electronic devices. This makes them ideal for applications where space is limited, such as in portable devices or densely packed electronic systems.2. Power Efficiency: IC chips are designed to be power-efficient, allowing electronic devices to operate with lower power consumption. This is particularly important in battery-powered devices, where power efficiency helps to extend battery life.3. Reliability: The integration of components onto a single chip reduces the number of interconnections and solder joints, improving the overall reliability of the circuit. IC chips are also less susceptible to environmental factors such as temperature and vibration, making them more robust.4. Cost-Effectiveness: Mass production of IC chips leads to economies of scale, making them more cost-effective compared to discrete components. This makes IC chips a preferred choice for high-volume production.As for application scenarios, IC chips are used in a wide range of electronic devices and systems, including:- Consumer Electronics: IC chips are found in smartphones, tablets, televisions, gaming consoles, and other consumer electronic devices.- Automotive Electronics: IC chips are used in various automotive systems, such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).- Industrial Control Systems: IC chips are employed in industrial automation, robotics, and control systems for precise and efficient operation.- Medical Devices: IC chips are utilized in medical equipment, such as patient monitoring systems, imaging devices, and implantable devices.- Communication Systems: IC chips are integral to communication systems, including wireless devices, routers, and network infrastructure.It's important to note that the specific advantages and application scenarios of the 70V7519S133BF8 IC chip would require detailed technical information about its features and specifications, which I don't have access to. For more specific information, I recommend consulting the datasheet or contacting the manufacturer of the chip.
70V7519S133BF8 Relevant information