CY7C1470BV33-167AXI

CY7C1470BV33-167AXI

Manufacturer No:

CY7C1470BV33-167AXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 100TQFP

Datasheet:

Datasheet

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CY7C1470BV33-167AXI Specifications

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The CY7C1470BV33-167AXI is a specific integrated circuit (IC) chip manufactured by Cypress Semiconductor. It is a high-density synchronous pipeline static random-access memory (SRAM) with a data bus width of 36 bits.Advantages of the CY7C1470BV33-167AXI IC chip: 1. High density: The chip offers a high storage capacity due to its SRAM architecture, enabling the storage of large amounts of data.2. Fast access time: The chip has a fast access time, providing quick read and write operations to the stored data.3. Pipeline architecture: The chip uses a pipeline architecture that allows for concurrent read and write operations, enabling efficient data processing and throughput.4. Low power consumption: The CY7C1470BV33-167AXI chip is designed to minimize power consumption, making it suitable for applications where low power is crucial.Application scenarios for the CY7C1470BV33-167AXI IC chip: 1. Networking: The high-density and fast access time of the chip make it suitable for networking applications that require buffering or caching large amounts of data, such as routers and switches.2. Data storage systems: The chip's high-density storage capacity can be utilized in data storage systems, including solid-state drives (SSDs), where fast access to stored data is critical.3. High-performance computing: The CY7C1470BV33-167AXI chip's pipeline architecture and quick access time make it suitable for high-performance computing applications where fast data processing and efficient memory access are required.4. Telecommunications: Due to its low power consumption and high-density storage, the chip can be used in telecommunication systems, such as base stations and network equipment, for efficient data handling and storage.It's important to note that the specific application scenarios may vary depending on the system requirements and design considerations.