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70V3399S133BFI8

70V3399S133BFI8

Manufacturer No:

70V3399S133BFI8

Description:

IC SRAM 2MBIT PARALLEL 208CABGA

Datasheet:

Datasheet

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70V3399S133BFI8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    133 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 18
  • Memory Size
    2Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70V3399S133BFI8 integrated circuit (IC) chip is a specific model that I am not familiar with, as my training data only goes up until March 2023. However, I can provide you with some general information about IC chips and their advantages and application scenarios.Integrated circuit chips are miniature electronic circuits that are fabricated onto a small semiconductor material, typically silicon. They contain various electronic components, such as transistors, resistors, capacitors, and diodes, all integrated onto a single chip. IC chips offer several advantages over discrete electronic components:1. Size and Space Efficiency: IC chips allow for the integration of multiple components onto a single chip, reducing the overall size and space required for electronic circuits. This makes them ideal for compact devices and applications where space is limited.2. Cost-Effectiveness: Mass production of IC chips leads to economies of scale, making them more cost-effective compared to discrete components. Additionally, the integration of multiple components onto a single chip reduces the need for additional wiring and assembly, further reducing costs.3. Power Efficiency: IC chips are designed to be power-efficient, consuming less energy compared to discrete components. This is particularly important in portable devices where battery life is a concern.4. Reliability: The integration of components onto a single chip reduces the number of interconnections, minimizing the risk of loose connections or failures due to external factors such as temperature variations or vibrations.As for application scenarios, IC chips are used in a wide range of electronic devices and systems, including:1. Consumer Electronics: IC chips are found in smartphones, tablets, laptops, televisions, gaming consoles, and other consumer electronic devices.2. Automotive Electronics: IC chips are used in various automotive systems, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and more.3. Industrial Automation: IC chips are employed in industrial control systems, robotics, process control, and monitoring equipment.4. Medical Devices: IC chips are used in medical devices such as pacemakers, implantable devices, diagnostic equipment, and monitoring systems.5. Communication Systems: IC chips are utilized in telecommunications equipment, networking devices, routers, modems, and wireless communication systems.It's important to note that the specific advantages and application scenarios of the 70V3399S133BFI8 IC chip may vary depending on its intended purpose and specifications. For detailed information about this particular chip, I recommend referring to the manufacturer's documentation or contacting the manufacturer directly.
70V3399S133BFI8 Relevant information