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70V657S12BFI

70V657S12BFI

Manufacturer No:

70V657S12BFI

Description:

IC SRAM 1.125MBIT PAR 208CABGA

Datasheet:

Datasheet

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70V657S12BFI Specifications

  • Type
    Parameter
  • Access Time
    12 ns
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Write Cycle Time - Word, Page
    12ns
  • Memory Interface
    Parallel
  • Memory Organization
    32K x 36
  • Memory Size
    1.125Mbit
  • Technology
    SRAM - Dual Port, Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The specific integrated circuit (IC) chip 70V657S12BFI is not widely recognized or documented. It is possible that this chip is either a rare or custom-made chip with limited information available. Therefore, it is difficult to determine the advantages and application scenarios specific to this chip.In general, advantages of integrated circuit chips include:1. Miniaturization: IC chips allow complex electronic circuits to be consolidated into a small form factor, saving space and enabling portability. 2. Cost-effectiveness: Investing in IC chips can be more economical compared to building individual circuits with discrete components. 3. Reliability: Integrated circuits are built on a single silicon wafer using various fabrication processes, which minimizes the number of interconnections and potential points of failure. 4. Power efficiency: Integrated circuits are designed to consume low power, making them suitable for battery-operated devices. 5. Performance: IC chips often provide faster operation, higher speeds, increased functionality, and improved accuracy compared to discrete component solutions.Without further details about the 70V657S12BFI chip, it is challenging to specify the application scenarios. Integrated circuits can have diverse applications in various fields such as electronics, telecommunications, automotive, medical devices, and more. Some common application areas for IC chips include:1. Microcontrollers: Used in embedded systems for controlling and monitoring functions in devices like appliances, robotics, or industrial equipment. 2. Analog and digital signal processing: IC chips can process and manipulate signals in applications such as audio, video, telecommunications, and data communication systems. 3. Memory chips: Used for storing and accessing data in electronic devices, including computers and consumer electronics. 4. Power management: IC chips can regulate and control power distribution and consumption in electronic devices, improving energy efficiency and safety. 5. Sensing and measurement: IC chips can integrate sensors and measurement circuits for applications in environmental monitoring, healthcare, automotive, etc.It is recommended to consult the datasheet, technical documentation, or the manufacturer's website for specific details and application scenarios related to the 70V657S12BFI IC chip.
70V657S12BFI Relevant information