70V658S12BC8

70V658S12BC8

Manufacturer No:

70V658S12BC8

Description:

IC SRAM 2MBIT PARALLEL 256CABGA

Datasheet:

Datasheet

Delivery:

Payment:

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70V658S12BC8 Specifications

  • Type
    Parameter
  • Access Time
    12 ns
  • Supplier Device Package
    256-CABGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Write Cycle Time - Word, Page
    12ns
  • Memory Interface
    Parallel
  • Memory Organization
    64K x 36
  • Memory Size
    2Mbit
  • Technology
    SRAM - Dual Port, Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70V658S12BC8 integrated circuit (IC) chip is a specific model that may have specific advantages and application scenarios. However, without additional context or details, it is challenging to provide a precise answer. Generally, IC chips offer various advantages such as:1. Miniaturization: IC chips allow complex electronic circuits to be condensed into a small size, enabling the development of smaller and more compact devices. 2. Increased Efficiency: IC chips are designed to operate with high precision and efficiency, resulting in improved overall performance of the electronic system. 3. Cost-Effective: The mass production and standardized design of IC chips lead to reduced manufacturing costs, making them an economical choice for electronic applications. 4. Reliability: IC chips undergo rigorous testing, ensuring their reliability and durability under specific operating conditions. 5. Versatility: IC chips can be designed for a wide range of applications, making them adaptable to various industries and sectors.Regarding potential application scenarios for the 70V658S12BC8 IC chip, it is necessary to refer to the specifications and datasheet provided by the manufacturer. These documents typically outline details such as the chip's power rating, input/output capabilities, communication protocols, and other specifications that determine its suitability for specific applications.