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GS8662T18BGD-350I

GS8662T18BGD-350I

Manufacturer No:

GS8662T18BGD-350I

Manufacturer:

GSI Technology Inc.

Description:

IC SRAM 72MBIT PARALLEL 165FPBGA

Datasheet:

Datasheet

Delivery:

Payment:

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GS8662T18BGD-350I Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    165-FPBGA (15x13)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 100°C (TJ)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    350 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 36
  • Memory Size
    72Mbit
  • Technology
    SRAM - Quad Port, Synchronous, DDR II
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The GS8662T18BGD-350I integrated circuit chips offer several advantages and can be applied in various scenarios. Here are some key points:1. High Performance: These chips are designed to deliver high performance, making them suitable for demanding applications that require fast processing speeds and efficient data handling.2. Power Efficiency: The GS8662T18BGD-350I chips are optimized for power efficiency, allowing them to operate with minimal power consumption. This feature is particularly beneficial in battery-powered devices or applications where energy efficiency is crucial.3. Integrated Features: These chips often come with a range of integrated features, such as memory, communication interfaces, and peripheral components. This integration simplifies the design process and reduces the need for additional external components, making them cost-effective and space-saving.4. Versatility: The GS8662T18BGD-350I chips can be used in various applications, including consumer electronics, automotive systems, industrial automation, and telecommunications. Their versatility stems from their ability to handle diverse tasks and adapt to different environments.5. Reliability: These chips are designed to meet high-quality standards, ensuring reliable operation even in challenging conditions. They are often built with robust materials and undergo rigorous testing to ensure long-term reliability and durability.6. Scalability: The GS8662T18BGD-350I chips are often part of a larger family of integrated circuits, offering scalability options. This means that different variants of the chip may be available, allowing designers to choose the one that best suits their specific requirements.In terms of application scenarios, the GS8662T18BGD-350I chips can be used in a wide range of fields. Some examples include:- Mobile Devices: These chips can be utilized in smartphones, tablets, and wearable devices to enable fast processing, efficient power management, and seamless connectivity.- Automotive Systems: The chips can be integrated into automotive electronics, such as infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs), to enhance performance, reliability, and connectivity.- Industrial Automation: These chips can be employed in industrial control systems, robotics, and factory automation equipment to enable precise control, real-time data processing, and efficient communication.- Telecommunications: The chips can be used in networking equipment, routers, and switches to handle high-speed data transmission, ensure reliable connectivity, and support advanced network protocols.- Internet of Things (IoT): The chips can be utilized in IoT devices, enabling them to collect, process, and transmit data efficiently, contributing to the growth of smart homes, smart cities, and other IoT applications.It's important to note that the specific advantages and application scenarios may vary depending on the exact specifications and capabilities of the GS8662T18BGD-350I chips.
GS8662T18BGD-350I Relevant information