IS61VVPS204818B-166B3LI

IS61VVPS204818B-166B3LI

Manufacturer No:

IS61VVPS204818B-166B3LI

Description:

IC SRAM 36MBIT PARALLEL 165TFBGA

Datasheet:

Datasheet

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IS61VVPS204818B-166B3LI Specifications

  • Type
    Parameter
  • Clock Frequency
    166 MHz
  • Supplier Device Package
    165-TFBGA (13x15)
  • Package / Case
    165-TBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.71V ~ 1.89V
  • Access Time
    3.8 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 18
  • Memory Size
    36Mbit
  • Technology
    SRAM - Synchronous, SDR
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
IS61VVPS204818B-166B3LI is a specific model of an integrated circuit (IC) chip, and its advantages and application scenarios would largely depend on its specific features and capabilities. However, without detailed information about this specific chip, it is not possible to provide specific advantages and application scenarios.Generally, IC chips are used in a wide range of applications in various industries. Some possible advantages and application scenarios for IC chips in general include:1. Miniaturization: IC chips allow for the integration of multiple electronic components and functions into a small form factor, enabling the development of compact and portable devices. 2. Cost-effectiveness: Mass production of IC chips can lead to reduced costs, making them affordable for various applications. 3. Power efficiency: IC chips can be designed to optimize power consumption, helping to extend battery life in portable devices or reducing energy consumption in larger systems. 4. Performance: IC chips can be tailored for specific functions, offering high-speed processing, memory capabilities, or specialized functionality that can enhance overall system performance. 5. Connectivity: IC chips can facilitate seamless integration with communication protocols or networking standards, enabling connectivity between devices and systems. 6. Reliability: IC chips can be designed to meet specific reliability and robustness requirements, ensuring consistent performance over extended periods of use. 7. Scalability: IC chips can offer scalability options, allowing designers to accommodate different performance levels or storage capacities based on the application requirements.It is important to refer to the datasheet or technical specifications of the specific IS61VVPS204818B-166B3LI model to understand its unique features, advantages, and application scenarios. The datasheet typically provides detailed information about the chip's functionality, electrical characteristics, compatibility, and application guidelines.