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70V3579S4BFG

70V3579S4BFG

Manufacturer No:

70V3579S4BFG

Description:

IC SRAM 1.125MBIT PAR 208CABGA

Datasheet:

Datasheet

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70V3579S4BFG Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    32K x 36
  • Memory Size
    1.125Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The 70V3579S4BFG integrated circuit chip is a specific model that I am not familiar with, as my training data only goes up until March 2023. However, I can provide you with some general information about integrated circuit chips and their advantages and application scenarios.Integrated circuit chips, also known as IC chips or microchips, are miniaturized electronic circuits that contain thousands or millions of electronic components, such as transistors, resistors, and capacitors, on a single semiconductor wafer. They are widely used in various electronic devices and systems due to their compact size, low power consumption, and high reliability.Advantages of integrated circuit chips include:1. Miniaturization: IC chips allow complex electronic circuits to be packed into a small form factor, enabling the development of smaller and more portable devices.2. Integration: Multiple electronic components can be integrated onto a single chip, reducing the need for external components and simplifying circuit design.3. Power efficiency: IC chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications.4. Reliability: The manufacturing process for IC chips involves stringent quality control measures, resulting in highly reliable and durable components.5. Cost-effectiveness: Mass production of IC chips leads to economies of scale, making them cost-effective compared to discrete electronic components.The application scenarios of IC chips are vast and diverse, ranging from consumer electronics to industrial systems. Some common application areas include:1. Telecommunications: IC chips are used in mobile phones, routers, and network equipment to enable wireless communication and data transfer.2. Computing: IC chips power computers, laptops, and servers, providing processing capabilities and memory storage.3. Automotive: IC chips are used in various automotive systems, such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).4. Medical devices: IC chips are employed in medical equipment, such as pacemakers, MRI machines, and glucose monitors, to enable accurate diagnostics and treatment.5. Internet of Things (IoT): IC chips are integral to IoT devices, enabling connectivity, data processing, and control in smart homes, wearables, and industrial automation.It's important to note that the specific advantages and application scenarios of the 70V3579S4BFG integrated circuit chip would require detailed technical information, which I am unable to provide. For specific details about this particular chip, I recommend referring to the manufacturer's documentation or consulting with an expert in the field.
70V3579S4BFG Relevant information