70V3579S4BC

70V3579S4BC

Manufacturer No:

70V3579S4BC

Description:

IC SRAM 1.125MBIT PAR 256CABGA

Datasheet:

Datasheet

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70V3579S4BC Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-CABGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    32K x 36
  • Memory Size
    1.125Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The 70V3579S4BC integrated circuit (IC) chips have several advantages and application scenarios, which include:1. High Performance: These IC chips offer high-speed operation and provide excellent data transfer rates, making them suitable for various high-performance applications.2. Large Storage Capacity: The 70V3579S4BC chips have a large storage capacity, allowing them to store a significant amount of data and information.3. Versatile Applications: These IC chips can be used in a wide range of applications such as telecom infrastructure, network switches, routers, data centers, storage arrays, and other high-speed communication systems.4. Power Efficiency: The chips are designed to be power-efficient, helping to reduce energy consumption and improve overall system efficiency.5. Scalability: The 70V3579S4BC chips offer scalability options, allowing them to be used in various system architectures and configurations.6. Reliability: These IC chips are known for their high reliability, ensuring consistent performance and minimizing the risk of system downtime.In summary, the 70V3579S4BC integrated circuit chips are suitable for high-performance applications that require large data storage capacity, power efficiency, scalability, and reliability. They find extensive use in telecommunications, networking, and data center environments.