CY7C1525KV18-250BZXI

CY7C1525KV18-250BZXI

Manufacturer No:

CY7C1525KV18-250BZXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 72MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C1525KV18-250BZXI Specifications

  • Type
    Parameter
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    250 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    8M x 9
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, QDR II
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C1387BV25-167AC is a high-performance synchronous SRAM (Static Random Access Memory) integrated circuit chip. Some of the advantages of this chip include:1. High-speed performance: The CY7C1387BV25-167AC offers high-speed operation, with access times as low as 2.5 ns. This makes it suitable for applications that require quick data read and write operations.2. Large storage capacity: This IC chip has a storage capacity of 16 megabits (2MB), which can accommodate a significant amount of data.3. Low power consumption: The CY7C1387BV25-167AC is designed to operate at low power levels, making it ideal for battery-powered devices or applications where minimizing power consumption is critical.4. Wide operating temperature range: The chip is capable of operating within a wide temperature range, typically from -40°C to 85°C. This enables it to be used in harsh or extreme environmental conditions.Some application scenarios of the CY7C1387BV25-167AC chip include:1. Networking equipment: The high-speed and large storage capacity of this chip make it suitable for use in networking equipment such as routers, switches, and network processors. It can help in buffering and storing data packets efficiently.2. Telecommunications systems: The chip's high-speed operation makes it suitable for use in telecommunications systems where real-time data processing, caching, or buffering is required.3. Industrial control systems: The wide operating temperature range and low power consumption of the chip make it suitable for use in industrial control systems, where it can be used for data storage, buffering, or caching in critical applications.4. Automotive electronics: The chip's ability to operate under extreme temperature conditions makes it suitable for automotive electronics, such as engine control units (ECUs) or infotainment systems, where reliability and high-performance memory are essential.5. Aerospace and defense applications: The chip's ruggedness, power efficiency, and high-speed operation make it suitable for use in aerospace and defense applications, such as avionics systems, radar systems, or secure communications systems.