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70V657S10BFG8

70V657S10BFG8

Manufacturer No:

70V657S10BFG8

Description:

IC SRAM 1.125MBIT PAR 208FPBGA

Datasheet:

Datasheet

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70V657S10BFG8 Specifications

  • Type
    Parameter
  • Access Time
    10 ns
  • Supplier Device Package
    208-CABGA (15x15)
  • Package / Case
    208-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Write Cycle Time - Word, Page
    10ns
  • Memory Interface
    Parallel
  • Memory Organization
    32K x 36
  • Memory Size
    1.125Mbit
  • Technology
    SRAM - Dual Port, Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70V657S10BFG8 is an integrated circuit chip that belongs to the CMOS (Complementary Metal-Oxide-Semiconductor) technology family. This chip offers several advantages and can be used in various application scenarios, such as:1. Low power consumption: The CMOS technology used in this chip ensures low-power operation, making it suitable for battery-powered devices and applications where power efficiency is critical.2. High performance: The 70V657S10BFG8 chip delivers high-speed operation and efficient signal processing capabilities, making it suitable for applications that require rapid data transfer and processing, such as data communication systems, networking equipment, and digital signal processing.3. Versatility: This chip is designed to handle a wide range of input and output voltages, making it versatile for use in various electronic devices and systems.4. Scalability: The 70V657S10BFG8 chip is available in different package options, allowing for flexibility in design and implementation. It can be used in both small-scale and large-scale applications.5. Memory interface: This chip includes a memory interface with built-in control functions, making it suitable for memory-intensive applications. It can be used for interfacing with various types of memories, such as SRAM, SDRAM, and flash memory.Application scenarios for the 70V657S10BFG8 chip include:1. Network switches/routers: The chip's high-speed operation and efficient signal processing capabilities make it suitable for use in network switches and routers, enabling fast and reliable data transfer.2. Data communication systems: This chip can be used in various communication systems, such as modems and data transceivers, to handle data processing and interface with memory devices.3. Consumer electronics: The low power consumption and versatility of this chip make it suitable for use in a wide range of consumer electronic devices, including smartphones, tablets, and portable media players.4. Industrial automation: The 70V657S10BFG8 chip can be used in industrial automation systems, where efficient signal processing and memory interface capabilities are required for controlling and monitoring various processes.5. Automotive electronics: This chip's high-speed operation and scalability make it applicable in automotive electronics, including applications like advanced driver-assistance systems (ADAS), infotainment systems, and engine control units.It's important to note that the specific advantages and application scenarios can vary based on the requirements and design considerations of a particular system or product.
70V657S10BFG8 Relevant information