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IS64LF204818B-7.5TQLA3-TR

IS64LF204818B-7.5TQLA3-TR

Manufacturer No:

IS64LF204818B-7.5TQLA3-TR

Description:

IC SRAM 36MBIT PARALLEL 100LQFP

Datasheet:

Datasheet

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IS64LF204818B-7.5TQLA3-TR Specifications

  • Type
    Parameter
  • Clock Frequency
    117 MHz
  • Supplier Device Package
    100-LQFP (14x20)
  • Package / Case
    100-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    3.135V ~ 3.465V
  • Access Time
    7.5 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 18
  • Memory Size
    36Mbit
  • Technology
    SRAM - Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The IS64LF204818B-7.5TQLA3-TR integrated circuit chips from Integrated Silicon Solution Inc (ISSI) have several advantages and can be used in various application scenarios. Here are some of the advantages and possible applications:Advantages: 1. High Density: The IS64LF204818B-7.5TQLA3-TR chips offer high memory density, making them suitable for applications that require storage of large amounts of data. 2. Low Power Consumption: These chips consume low power, which is advantageous for battery-operated devices or systems where power efficiency is critical. 3. Fast Data Access: The integrated circuit chips provide fast access times, ensuring quick retrieval and processing of data. 4. Small Form Factor: The chips are available in a small form factor, making them suitable for compact devices or space-constrained applications. 5. Extended Temperature Range: The IS64LF204818B-7.5TQLA3-TR chips are designed to operate over an extended temperature range, enabling them to be used in harsh environment applications.Application Scenarios: 1. Embedded Systems: The high storage density and low power consumption make these chips suitable for embedded systems, such as industrial automation, IoT devices, and automotive applications. 2. Communication Systems: The fast access times and high-density memory can be beneficial in applications that require high-speed data buffering, such as routers, switches, and network equipment. 3. Consumer Electronics: The small form factor and low power consumption make the chips suitable for various consumer electronic devices, including smartphones, tablets, digital cameras, and portable media players. 4. Medical Devices: The extended temperature range and high-density memory can be advantageous in medical devices like patient monitors, implantable devices, or medical imaging equipment. 5. Aerospace and Defense: The chips' ability to operate in harsh environmental conditions, coupled with high storage density, makes them suitable for aerospace and defense applications, including avionics, military communication systems, and surveillance equipment.It's important to note that the specified advantages and applications are based on the general characteristics of IS64LF204818B-7.5TQLA3-TR chips. The actual suitability and performance in specific applications may vary, requiring a detailed evaluation of the chip's datasheet and application requirements.
IS64LF204818B-7.5TQLA3-TR Relevant information