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70V3579S4BC8

70V3579S4BC8

Manufacturer No:

70V3579S4BC8

Description:

IC SRAM 1.125MBIT PAR 256CABGA

Datasheet:

Datasheet

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70V3579S4BC8 Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-CABGA (17x17)
  • Package / Case
    256-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    3.15V ~ 3.45V
  • Access Time
    4.2 ns
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    32K x 36
  • Memory Size
    1.125Mbit
  • Technology
    SRAM - Dual Port, Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 70V3579S4BC8 integrated circuit (IC) chip is a specific model that I am not familiar with, as my training data only goes up until March 2023. However, I can provide you with some general information about IC chips and their advantages and application scenarios.Integrated circuit chips are miniature electronic circuits that are etched onto a small semiconductor material, typically silicon. They contain a combination of transistors, resistors, capacitors, and other electronic components, all integrated onto a single chip. IC chips offer several advantages over discrete electronic components:1. Size and Space Efficiency: IC chips allow for the integration of multiple components onto a single chip, reducing the overall size and complexity of electronic devices. This makes them ideal for applications where space is limited, such as in portable devices or densely packed electronic systems.2. Power Efficiency: IC chips are designed to be power-efficient, allowing electronic devices to operate for longer periods on limited power sources, such as batteries. This is particularly important for portable devices and energy-conscious applications.3. Reliability: The integration of components onto a single chip reduces the number of interconnections and solder joints, minimizing the risk of failure due to loose connections or environmental factors. IC chips are generally more reliable than discrete components.4. Cost-Effectiveness: Mass production of IC chips results in economies of scale, making them more cost-effective compared to assembling individual discrete components. This makes IC chips suitable for high-volume production and consumer electronics.As for application scenarios, IC chips are used in a wide range of electronic devices and systems, including:1. Consumer Electronics: IC chips are found in smartphones, tablets, televisions, gaming consoles, and other consumer electronic devices. They enable various functionalities, such as processing, memory storage, wireless communication, and audio/video processing.2. Automotive Electronics: IC chips are used in automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and powertrain control modules. They help improve vehicle performance, safety, and efficiency.3. Industrial Control Systems: IC chips are utilized in industrial automation, robotics, and control systems. They enable precise control, monitoring, and communication in manufacturing processes, power distribution systems, and other industrial applications.4. Medical Devices: IC chips play a crucial role in medical devices, such as pacemakers, implantable devices, diagnostic equipment, and monitoring systems. They enable accurate measurements, data processing, and communication in healthcare settings.It's important to note that the specific advantages and application scenarios of the 70V3579S4BC8 IC chip may vary depending on its design and intended purpose. For detailed information about this particular chip, I recommend referring to the manufacturer's documentation or contacting the manufacturer directly.
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