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CY7C2268XV18-633BZXC

CY7C2268XV18-633BZXC

Manufacturer No:

CY7C2268XV18-633BZXC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 36MBIT PAR 165FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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CY7C2268XV18-633BZXC Specifications

  • Type
    Parameter
  • Clock Frequency
    633 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 18
  • Memory Size
    36Mbit
  • Technology
    SRAM - Synchronous, DDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C2268XV18-633BZXC integrated circuit chips offer several advantages and can be used in various application scenarios. Some of the advantages and application scenarios are as follows:Advantages: 1. High Speed: The CY7C2268XV18-633BZXC chips operate at high-speed performance, making them suitable for applications requiring fast data processing and transmission. 2. Low Power Consumption: These chips are designed to consume low power, ensuring energy efficiency in electronic devices. 3. Large Capacity: With a large storage capacity, the CY7C2268XV18-633BZXC chips can handle extensive data storage requirements. 4. Reliable Performance: Cypress Semiconductor, the manufacturer of these chips, is known for providing high-quality and reliable semiconductor solutions. 5. Flexibility: The CY7C2268XV18-633BZXC chips offer flexibility in terms of programming options, making them adaptable to different use cases and custom applications.Application Scenarios: 1. Networking and Telecommunications: These chips are ideal for networking and telecommunications applications where high-speed data processing, large storage capacity, and low power consumption play a critical role. 2. Data Centers: With their high-speed performance and large storage capacity, CY7C2268XV18-633BZXC chips can be used in data centers for data storage, processing, and networking purposes. 3. High-Performance Computing: They can also be used in high-performance computing applications, such as supercomputers or servers, to handle complex calculations and data-intensive tasks. 4. Industrial Automation: The chips' reliability and low power consumption make them suitable for industrial automation applications, including control systems and robotics. 5. Automotive Electronics: These chips can be utilized in automotive electronics for applications like infotainment systems, advanced driver-assistance systems, and onboard data storage.It is important to note that the specific use and suitability of the CY7C2268XV18-633BZXC chips may vary based on individual requirements, and it is always recommended to consult the datasheet and technical specifications provided by Cypress Semiconductor for accurate information and guidelines.
CY7C2268XV18-633BZXC Relevant information