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CY7C2265XV18-633BZXC

CY7C2265XV18-633BZXC

Manufacturer No:

CY7C2265XV18-633BZXC

Manufacturer:

Infineon Technologies

Description:

IC SRAM 36MBIT PAR 165FBGA

Datasheet:

Datasheet

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CY7C2265XV18-633BZXC Specifications

  • Type
    Parameter
  • Clock Frequency
    633 MHz
  • Supplier Device Package
    165-FBGA (13x15)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.7V ~ 1.9V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    Parallel
  • Memory Organization
    1M x 36
  • Memory Size
    36Mbit
  • Technology
    SRAM - Synchronous, QDR II+
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C2265XV18-633BZXC integrated circuit (IC) chip is a high-speed and high-density synchronous SRAM designed by Cypress Semiconductor. Some advantages and application scenarios of this chip are:Advantages:1. High-Speed Operation: The CY7C2265XV18-633BZXC chip operates at a high-speed access of 18 ns, which allows for faster data transfer and processing.2. High-Density Storage: It offers a density of 1 Mbit (128K x 8), providing ample storage capacity for data-intensive applications.3. Low Power Consumption: The IC chip is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.4. Synchronous Interface: The chip provides a synchronous interface, enabling synchronized communication between the IC and the device it is connected to.5. Reliable Performance: Cypress Semiconductor is known for its high-quality products, ensuring reliable performance and durability of the chip.Application Scenarios:1. Networking Equipment: The CY7C2265XV18-633BZXC IC chip can be used in networking equipment such as routers, switches, and network processors. Its high-speed operation and synchronous interface enable efficient data storage and processing in these devices.2. Embedded Systems: This IC chip can be integrated into various embedded systems that require high-performance memory storage, such as industrial control systems, automotive electronics, and consumer electronics.3. Telecommunication Infrastructure: It finds applications in telecommunication infrastructure equipment like base stations, radio network controllers, and optical networking units. The chip's high-density storage and low power consumption make it suitable for these applications.4. Medical Devices: The CY7C2265XV18-633BZXC chip can be used in medical devices like imaging equipment, patient monitoring systems, and diagnostic devices. Its high speed and reliability contribute to the efficient processing and storage of medical data.5. Aerospace and Defense: The chip's high-speed operation and reliable performance make it suitable for aerospace and defense applications, including avionics systems, radar systems, and mission-critical communication equipment.In summary, the CY7C2265XV18-633BZXC chip offers advantages such as high-speed operation, high-density storage, low power consumption, and reliable performance. It finds applications in various fields such as networking, embedded systems, telecommunication, medical devices, and aerospace and defense.
CY7C2265XV18-633BZXC Relevant information