IS61QDPB22M36A-333M3L
Manufacturer No:
IS61QDPB22M36A-333M3L
Manufacturer:
Description:
IC SRAM 72MBIT PARALLEL 165LFBGA
Datasheet:
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IS61QDPB22M36A-333M3L Specifications
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TypeParameter
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Supplier Device Package165-LFBGA (15x17)
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Package / Case165-LBGA
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C (TA)
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Voltage - Supply1.71V ~ 1.89V
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Access Time8.4 ns
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Write Cycle Time - Word, Page-
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Clock Frequency333 MHz
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Memory InterfaceParallel
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Memory Organization2M x 36
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Memory Size72Mbit
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TechnologySRAM - Synchronous, QUADP
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Memory FormatSRAM
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Memory TypeVolatile
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series-
The IS61QDPB22M36A-333M3L is a specific integrated circuit (IC) chip manufactured by Integrated Silicon Solution Inc. (ISSI). While I don't have access to the specific details of this chip, I can provide you with some general information about IC chips and their applications.Advantages of IC chips: 1. Miniaturization: IC chips consolidate many components into a single chip, reducing the size of electronic devices. 2. Power efficiency: IC chips are designed to consume less power, making them suitable for portable devices. 3. Cost-effective: Mass production of IC chips reduces their manufacturing cost, making them affordable for various applications. 4. Reliability: IC chips are less prone to failures as they are constructed using automated manufacturing techniques. 5. Versatility: IC chips can be customized to perform specific functions, making them adaptable for a wide range of applications.However, to provide more accurate advantages and application scenarios for the specific IC model you mentioned, I would need access to its datasheet or specific documentation from the manufacturer. The datasheet would detail the chip's features, capabilities, and potential applications.
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