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IS61QDP2B44M18A-400M3L

IS61QDP2B44M18A-400M3L

Manufacturer No:

IS61QDP2B44M18A-400M3L

Description:

IC SRAM 72MBIT PARALLEL 165LFBGA

Datasheet:

Datasheet

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IS61QDP2B44M18A-400M3L Specifications

  • Type
    Parameter
  • Supplier Device Package
    165-LFBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.71V ~ 1.89V
  • Access Time
    8.4 ns
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    400 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 18
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, QUADP
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The IS61QDP2B44M18A-400M3L is a specific integrated circuit (IC) chip, designed for high-performance memory applications. Here are some of its advantages and application scenarios:1. High-speed operation: This IC chip operates at a clock frequency of 400MHz, allowing for fast data access and transfer rates. It is suitable for applications that require quick data retrieval and processing.2. Low power consumption: The chip is designed with low power requirements, making it energy-efficient. This feature is beneficial for devices that operate on battery power or have limited power capabilities.3. Large memory capacity: The IS61QDP2B44M18A-400M3L has a capacity of 4Gb (gigabits), which translates to 512MB (megabytes) of memory. This makes it suitable for applications that require significant storage capacity, such as high-resolution images, videos, or large datasets.4. Wide temperature range: The IC chip is designed to operate reliably across a wide temperature range (-40°C to +85°C). This makes it suitable for environments with extreme temperature conditions, such as automotive electronics or industrial applications.5. Parallel interface: The chip supports a parallel interface, allowing for efficient data transfer between the memory and the host device. This makes it suitable for applications that require high bandwidth and parallel processing, such as embedded systems, networking devices, or high-performance computing.6. Package and compatibility: The IC chip is packaged in a small form factor, such as the 165-ball FBGA (Fine-pitch Ball Grid Array) package, making it suitable for space-constrained designs. Additionally, it is compatible with various industry-standard interfaces and protocols, ensuring easy integration into existing systems.Some common application scenarios for the IS61QDP2B44M18A-400M3L IC chip include:1. Solid-state drives (SSDs): The high-speed operation and large memory capacity of the chip make it suitable for use in SSDs, which require fast and reliable storage for high-performance computing systems or data centers.2. Network equipment: The chip's high-speed operation and parallel interface make it suitable for networking devices like switches and routers, where efficient data transfer and processing are crucial for maintaining network performance.3. Automotive electronics: The wide temperature range and reliable operation of the chip make it suitable for automotive applications, such as infotainment systems, driver-assistance systems, or data loggers.4. Industrial controls: The chip's ruggedness, low power consumption, and large memory capacity make it suitable for various industrial control applications, such as robotics, process automation, or monitoring systems.5. Medical devices: The chip's low power consumption and high-speed operation make it beneficial for medical devices, such as patient monitoring systems, imaging equipment, or portable medical devices.It is important to note that specific application requirements may vary, and designers should carefully evaluate the chip's specifications and features to determine its suitability for a particular use case.
IS61QDP2B44M18A-400M3L Relevant information