IS61DDP2B42M36A-400M3L

IS61DDP2B42M36A-400M3L

Manufacturer No:

IS61DDP2B42M36A-400M3L

Description:

IC SRAM 72MBIT PARALLEL 165LFBGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

IS61DDP2B42M36A-400M3L Specifications

  • Type
    Parameter
  • Supplier Device Package
    165-LFBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.71V ~ 1.89V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    400 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 36
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, DDR IIP
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The IS61DDP2B42M36A-400M3L integrated circuit chip is a specific type of chip that belongs to the IS61DDP2B42M36A family of products developed by Renesas Electronics. It is a high-speed, low-power, double data rate (DDR) synchronous dynamic random-access memory (SDRAM) chip. Advantages:1. High-speed performance: The IS61DDP2B42M36A-400M3L chip operates at a clock speed of 400 MHz, enabling fast and efficient data transfer within the system. This makes it suitable for applications requiring high-speed processing, such as network routers, servers, and graphics-intensive systems.2. Large memory capacity: With a storage capacity of 2 Gbits (Gigabits), this chip provides ample memory for storing and accessing large amounts of data. It is beneficial for applications that require significant memory resources, such as data centers, cloud computing, and advanced multimedia systems.3. Low power consumption: The chip is designed to operate at low power, minimizing energy consumption and heating issues. It is well-suited for portable devices, battery-operated systems, and other power-sensitive applications.4. DDR architecture: The chip utilizes DDR technology, which allows simultaneous read and write operations, resulting in improved data transfer rates compared to older memory technologies. It is ideal for applications demanding high bandwidth and efficient memory access, such as gaming consoles, video processing systems, and high-performance embedded systems.Application Scenarios:1. Networking equipment: The IS61DDP2B42M36A-400M3L chip is commonly used in networking devices, such as routers, switches, and network interface cards. Its high-speed and high-capacity memory enable efficient packet processing, data buffering, and fast data exchange in network infrastructure.2. Server systems: Servers require large memory capacity and fast data access to handle numerous simultaneous requests and process large data sets. This chip can be used in server systems to provide reliable, high-performance memory for applications like data centers, cloud computing, and virtualization.3. High-performance computing: The chip's high-speed processing capability makes it suitable for high-performance computing applications like supercomputers, scientific research, and simulations. It can assist in handling complex calculations and data-intensive tasks.4. Multimedia applications: With its sizeable memory capacity, the chip is employed in multimedia devices such as digital video recorders, gaming consoles, and high-definition displays. It helps in storing and accessing multimedia content, enhancing system responsiveness and overall performance.5. Embedded systems: The IS61DDP2B42M36A-400M3L chip is utilized in various embedded systems that require high-speed memory access, low power consumption, and ample memory capacity. Applications can include automotive electronics, industrial control systems, and medical devices.Overall, the IS61DDP2B42M36A-400M3L chip offers advantages in terms of high-speed performance, large memory capacity, low power consumption, and DDR architecture. It finds applications in networking, server systems, high-performance computing, multimedia devices, and embedded systems.