SM662PAE-BESS
Manufacturer No:
SM662PAE-BESS
Manufacturer:
Description:
IC FLASH 640GBIT EMMC 100BGA
Datasheet:
Delivery:
![](/static/public/images/DHL.png)
![](/static/public/images/TNT.webp)
![](/static/public/images/UPS.png)
![](/static/public/images/FedEx.png)
![](/static/public/images/SF-Express.webp)
Payment:
![](/static/public/images/paypal.png)
![](/static/public/images/paypal02.png)
![](/static/public/images/paypal03.png)
![](/static/public/images/paypal04.png)
In Stock : 0
Please send RFQ , we will respond immediately.
![](/static/public/images/kenko_Certif02.png)
![](/static/public/images/kenko_Certif07.png)
![](/static/public/images/kenko_Certif03.png)
![](/static/public/images/kenko_Certif04.png)
![](/static/public/images/kenko_Certif08.png)
![](/static/public/images/kenko_Certif10.png)
![](/static/public/images/kenko_Certif09.png)
![](/static/public/images/kenko_Certif05.png)
![](/static/public/images/kenko_Certif06.png)
SM662PAE-BESS Specifications
-
TypeParameter
-
Supplier Device Package100-BGA (14x18)
-
Package / Case100-LBGA
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 105°C
-
Voltage - Supply-
-
Access Time-
-
Write Cycle Time - Word, Page-
-
Memory InterfaceeMMC
-
Memory Organization80G x 8
-
Memory Size640Gbit
-
TechnologyFLASH - NAND (SLC), FLASH - NAND (TLC)
-
Memory FormatFLASH
-
Memory TypeNon-Volatile
-
DigiKey ProgrammableNot Verified
-
PackagingTray
-
Product StatusActive
-
SeriesFerri-eMMC®
The SM662PAE-BESS integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Efficiency: These chips are designed to provide high efficiency power conversion, resulting in reduced power losses and improved energy efficiency. 2. Compact Size: The chips are compact in size, making them suitable for applications where space is limited. 3. High Power Density: They offer high power density, allowing for the design of power systems with higher power output in a smaller form factor. 4. Wide Input Voltage Range: The chips can operate over a wide input voltage range, making them suitable for various power supply applications. 5. Protection Features: They come with built-in protection features such as overvoltage protection, overcurrent protection, and thermal shutdown, ensuring safe and reliable operation.Application Scenarios: 1. Battery Energy Storage Systems (BESS): These chips are specifically designed for BESS applications, where they can be used for power conversion and management in energy storage systems. 2. Renewable Energy Systems: The chips can be used in renewable energy systems such as solar power and wind power systems, where they can convert and manage the power generated from these sources. 3. Electric Vehicles (EVs): They can be used in EV charging systems, where they can efficiently convert the AC power from the grid to DC power for charging the EV batteries. 4. Uninterruptible Power Supplies (UPS): The chips can be used in UPS systems to convert and manage power during power outages, ensuring continuous power supply to critical loads. 5. Industrial Power Systems: They can be used in various industrial power systems, such as motor drives, power supplies, and industrial automation systems, where efficient power conversion is required.Overall, the SM662PAE-BESS integrated circuit chips offer high efficiency, compact size, and various protection features, making them suitable for a range of power conversion and management applications, particularly in battery energy storage systems.
SM662PAE-BESS Relevant information
-
CY7C1051H30-10ZSXIT
Infineon Technologies -
EM008LXOAB320CS1R
Everspin Technologies Inc. -
S25HS01GTDPMHB010
Infineon Technologies -
MT60B4G4HB-56B:G
Micron Technology Inc. -
CY15B104QI-20BFXIT
Infineon Technologies -
CY15V104QI-20BFXIT
Infineon Technologies -
CY15B104QI-20LPXIT
Infineon Technologies -
CY15B104QI-20LPXCT
Infineon Technologies -
CY15V104QI-20LPXCT
Infineon Technologies -
CY15V104QI-20LPXIT
Infineon Technologies