70V3379S4BF8
Manufacturer No:
70V3379S4BF8
Manufacturer:
Description:
IC SRAM 576KBIT PAR 208CABGA
Datasheet:
Delivery:
![](/static/public/images/DHL.png)
![](/static/public/images/TNT.webp)
![](/static/public/images/UPS.png)
![](/static/public/images/FedEx.png)
![](/static/public/images/SF-Express.webp)
Payment:
![](/static/public/images/paypal.png)
![](/static/public/images/paypal02.png)
![](/static/public/images/paypal03.png)
![](/static/public/images/paypal04.png)
In Stock : 0
Please send RFQ , we will respond immediately.
![](/static/public/images/kenko_Certif02.png)
![](/static/public/images/kenko_Certif07.png)
![](/static/public/images/kenko_Certif03.png)
![](/static/public/images/kenko_Certif04.png)
![](/static/public/images/kenko_Certif08.png)
![](/static/public/images/kenko_Certif10.png)
![](/static/public/images/kenko_Certif09.png)
![](/static/public/images/kenko_Certif05.png)
![](/static/public/images/kenko_Certif06.png)
70V3379S4BF8 Specifications
-
TypeParameter
-
Access Time4.2 ns
-
DigiKey ProgrammableNot Verified
-
Supplier Device Package208-CABGA (15x15)
-
Package / Case208-LFBGA
-
Mounting TypeSurface Mount
-
Operating Temperature0°C ~ 70°C (TA)
-
Voltage - Supply3.15V ~ 3.45V
-
Write Cycle Time - Word, Page-
-
Memory InterfaceParallel
-
Memory Organization32K x 18
-
Memory Size576Kbit
-
TechnologySRAM - Dual Port, Synchronous
-
Memory FormatSRAM
-
Memory TypeVolatile
-
PackagingTape & Reel (TR)
-
Product StatusActive
-
Series-
The 70V3379S4BF8 is a specific integrated circuit (IC) chip, and without detailed information about its specifications and features, it is challenging to provide specific advantages and application scenarios. However, here are some general advantages and potential application scenarios for IC chips:Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Power efficiency: IC chips are designed to be power-efficient, reducing energy consumption and extending battery life in portable devices. 3. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and long-term performance. 4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications. 5. Versatility: IC chips can be designed for a wide range of applications, offering flexibility and adaptability.Application scenarios for IC chips: 1. Consumer electronics: IC chips are extensively used in smartphones, tablets, laptops, televisions, and other consumer electronic devices. 2. Automotive industry: IC chips are employed in various automotive systems, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 3. Industrial automation: IC chips find applications in industrial control systems, robotics, process control, and monitoring equipment. 4. Medical devices: IC chips are used in medical devices such as pacemakers, insulin pumps, diagnostic equipment, and implantable devices. 5. Communication systems: IC chips are crucial components in telecommunications infrastructure, networking equipment, and wireless communication devices.It is important to note that the specific advantages and application scenarios of the 70V3379S4BF8 IC chip may vary based on its unique features and specifications.
70V3379S4BF8 Relevant information
-
CY7C1051H30-10ZSXIT
Infineon Technologies -
EM008LXOAB320CS1R
Everspin Technologies Inc. -
S25HS01GTDPMHB010
Infineon Technologies -
MT60B4G4HB-56B:G
Micron Technology Inc. -
CY15B104QI-20BFXIT
Infineon Technologies -
CY15V104QI-20BFXIT
Infineon Technologies -
CY15B104QI-20LPXIT
Infineon Technologies -
CY15B104QI-20LPXCT
Infineon Technologies -
CY15V104QI-20LPXCT
Infineon Technologies -
CY15V104QI-20LPXIT
Infineon Technologies