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IS61DDB24M18A-300M3L

IS61DDB24M18A-300M3L

Manufacturer No:

IS61DDB24M18A-300M3L

Description:

IC SRAM 72MBIT PARALLEL 165LFBGA

Datasheet:

Datasheet

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IS61DDB24M18A-300M3L Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    165-LFBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.71V ~ 1.89V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    300 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    4M x 18
  • Memory Size
    72Mbit
  • Technology
    SRAM - Synchronous, DDR II
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The IS61DDB24M18A-300M3L integrated circuit (IC) chips are 16M (2Mx8) high-speed CMOS static RAM (SRAM) chips. Some of the advantages and application scenarios of these chips are:1. High-speed operation: The IS61DDB24M18A-300M3L chips function at a high operating frequency, which allows for fast data access and retrieval. This makes them suitable for applications that require real-time data processing or high-speed communication.2. Large memory capacity: With a capacity of 16Mbits, these chips can store a large amount of data. This makes them ideal for applications that deal with large datasets, such as data logging, data acquisition, or multimedia storage.3. Low power consumption: The IS61DDB24M18A-300M3L chips are designed to operate at low power, making them energy-efficient. This feature is particularly useful in battery-powered devices or applications where power consumption needs to be minimized.4. Easy integration: These chips feature a standard SRAM interface and can be easily interfaced with a wide range of microcontrollers, processors, or other ICs. This allows for seamless integration into existing systems or designs.5. Industrial and automotive applications: The IS61DDB24M18A-300M3L chips are designed to withstand harsh environments and are suitable for industrial or automotive applications. They have a wide operating temperature range, high reliability, and can withstand vibrations and shocks.6. Communication systems: These chips can be used in communication systems that require fast data processing and buffering, such as routers, switches, or base stations.7. Medical devices: The high-speed operation and large memory capacity of these chips make them suitable for medical devices that require real-time data processing, such as imaging equipment, patient monitors, or diagnostic devices.8. Aerospace and defense: The IS61DDB24M18A-300M3L chips can be utilized in aerospace and defense applications, where high reliability and high-performance memory are crucial, such as avionics systems, satellites, or radar systems.Overall, the IS61DDB24M18A-300M3L chips offer advantages like high-speed operation, large memory capacity, low power consumption, easy integration, and are suitable for various application scenarios across industries.
IS61DDB24M18A-300M3L Relevant information