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IS61QDP2B22M18A-333M3L

IS61QDP2B22M18A-333M3L

Manufacturer No:

IS61QDP2B22M18A-333M3L

Description:

IC SRAM 36MBIT PARALLEL 165LFBGA

Datasheet:

Datasheet

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IS61QDP2B22M18A-333M3L Specifications

  • Type
    Parameter
  • Access Time
    8.4 ns
  • Supplier Device Package
    165-LFBGA (15x17)
  • Package / Case
    165-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Voltage - Supply
    1.71V ~ 1.89V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    333 MHz
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 18
  • Memory Size
    36Mbit
  • Technology
    SRAM - Synchronous, QUADP
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The IS61QDP2B22M18A-333M3L integrated circuit (IC) chip is a high-speed, low-power Double Data Rate 3 (DDR3) synchronous dynamic random-access memory (SDRAM) chip. Some of its advantages and application scenarios are:1. High-speed performance: The IS61QDP2B22M18A-333M3L chip offers fast data transfer rates, which makes it suitable for applications that require high-speed data processing, such as advanced gaming systems, high-performance computing, graphics processing units (GPUs), and networking equipment.2. Low power consumption: This chip is designed to operate at low voltage levels, resulting in reduced power consumption. This feature is particularly advantageous in battery-powered devices like smartphones, tablets, and portable gaming consoles, where power efficiency is crucial for prolonged battery life.3. High-density storage: The IS61QDP2B22M18A-333M3L chip has a large memory capacity, typically ranging from a few gigabytes to tens of gigabytes. This makes it suitable for applications that require large amounts of data storage, such as servers, workstations, and data centers.4. Reliable operation: This chip incorporates various error correction techniques and memory redundancy to ensure the integrity and reliability of stored data. It is often used in mission-critical systems, such as aerospace and defense applications, where data integrity and system reliability are paramount.5. Compatibility: The IS61QDP2B22M18A-333M3L chip follows the industry-standard DDR3 interface specifications, making it compatible with existing DDR3 memory systems. This compatibility facilitates its integration into a wide range of electronic devices and allows for easy upgrades or replacements.6. Industrial temperature range: The IS61QDP2B22M18A-333M3L chip is designed to operate reliably across a wide temperature range, typically from -40°C to 85°C. This makes it suitable for demanding environments such as automotive systems, outdoor equipment, and industrial applications.Overall, the IS61QDP2B22M18A-333M3L integrated circuit chip's high-speed performance, low power consumption, high-density storage, reliability, compatibility, and industrial temperature range make it well-suited for a variety of applications that require fast and efficient data processing.
IS61QDP2B22M18A-333M3L Relevant information