EM08APGD3-BA000-2

EM08APGD3-BA000-2

Manufacturer No:

EM08APGD3-BA000-2

Manufacturer:

Delkin Devices, Inc.

Description:

IC FLASH 64GBIT EMMC 153FBGA

Datasheet:

Datasheet

Delivery:

Payment:

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EM08APGD3-BA000-2 Specifications

  • Type
    Parameter
  • Clock Frequency
    200 MHz
  • Supplier Device Package
    153-FBGA (11.5x13)
  • Package / Case
    153-VFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.7V ~ 3.6V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    eMMC
  • Memory Organization
    8G x 8
  • Memory Size
    64Gbit
  • Technology
    FLASH - NAND (MLC)
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    G530
The EM08APGD3-BA000-2 integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with minimal power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: The compact size of these chips allows for easy integration into various electronic devices, including wearable devices, IoT devices, and small-scale electronics. 3. High performance: Despite their small size, these chips offer high performance and processing capabilities, enabling efficient data processing and communication. 4. Versatility: The chips support multiple communication protocols, such as Bluetooth, Wi-Fi, and Zigbee, making them suitable for a wide range of applications. 5. Security features: These chips often come with built-in security features, including encryption and authentication mechanisms, ensuring secure data transmission and protection against unauthorized access.Application scenarios: 1. Internet of Things (IoT): These chips are commonly used in IoT devices, such as smart home appliances, wearable devices, and industrial sensors, enabling seamless connectivity and data exchange. 2. Wireless communication: The chips' support for various wireless communication protocols makes them suitable for applications like wireless sensors, remote control systems, and wireless data transmission. 3. Home automation: These chips can be integrated into home automation systems, allowing users to control and monitor various devices and appliances remotely. 4. Healthcare devices: The low power consumption and small form factor of these chips make them ideal for healthcare devices like fitness trackers, remote patient monitoring systems, and medical sensors. 5. Industrial automation: These chips can be used in industrial automation systems, enabling wireless communication between different components and improving overall efficiency and productivity.Overall, the EM08APGD3-BA000-2 integrated circuit chips offer low power consumption, high performance, and versatility, making them suitable for a wide range of applications in IoT, wireless communication, home automation, healthcare, and industrial automation.