TH58NYG3S0HBAI4
Manufacturer No:
TH58NYG3S0HBAI4
Manufacturer:
Description:
IC FLASH 8GBIT PARALLEL 63TFBGA
Datasheet:
Delivery:
Payment:
In Stock : 46
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TH58NYG3S0HBAI4 Specifications
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TypeParameter
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Supplier Device Package63-TFBGA (9x11)
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Package / Case63-VFBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Voltage - Supply1.7V ~ 1.95V
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Access Time25 ns
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Write Cycle Time - Word, Page25ns
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Memory InterfaceParallel
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Memory Organization1G x 8
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Memory Size8Gbit
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TechnologyFLASH - NAND (SLC)
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Memory FormatFLASH
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Memory TypeNon-Volatile
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DigiKey ProgrammableNot Verified
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PackagingTray
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Product StatusActive
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Series-
The TH58NYG3S0HBAI4 is a specific model of integrated circuit chips developed by Toshiba. However, as an AI language model, I don't have access to the specific technical details of this particular chip model. Therefore, I cannot provide the advantages and application scenarios of TH58NYG3S0HBAI4 specifically.In general, advantages and application scenarios of integrated circuit chips vary depending on their specific features and capabilities. Some common advantages of integrated circuit chips include:1. Miniaturization: Integrated circuit chips can pack a large number of electronic components into a small form factor, resulting in space-efficient designs. 2. Cost-effectiveness: Integrated circuit chips can often be produced at a lower cost compared to individual discrete components, resulting in cost savings during manufacturing. 3. Power efficiency: Integrated circuit chips can optimize power consumption, leading to longer battery life and reduced energy requirements. 4. Increased reliability: Integrated circuit chips reduce the need for interconnection wiring, decreasing points of failure and increasing overall reliability. 5. Enhanced performance: Integrated circuit chips can integrate complex circuits, enabling improved performance and faster operation.The application scenarios of integrated circuit chips are vast and varied, covering almost all areas of electronics. Integrated circuits are used in computers, consumer electronics, automobiles, telecommunications, medical devices, industrial equipment, and aerospace applications. They are employed in microcontrollers, memory chips, processors, amplifiers, sensors, and a wide range of other electronic components and systems.To understand the specific advantages and application scenarios of the TH58NYG3S0HBAI4 chip, it would be best to refer to the manufacturer's datasheet or technical specifications, as they will provide detailed information about the chip's features, benefits, and suggested applications.
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