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S70FL01GSDPBHVC13

S70FL01GSDPBHVC13

Manufacturer No:

S70FL01GSDPBHVC13

Manufacturer:

Infineon Technologies

Description:

IC FLASH 1GBIT SPI/QUAD 24BGA

Datasheet:

Datasheet

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S70FL01GSDPBHVC13 Specifications

  • Type
    Parameter
  • Clock Frequency
    66 MHz
  • Supplier Device Package
    24-BGA (8x6)
  • Package / Case
    24-TBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    SPI - Quad I/O
  • Memory Organization
    128M x 8
  • Memory Size
    1Gbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    FL-S
The S70FL01GSDPBHVC13 integrated circuit chip, manufactured by Cypress Semiconductor, is a high-performance, high-density, and non-volatile memory IC. Here are some of its advantages and application scenarios:Advantages:1. High density: The S70FL01GSDPBHVC13 chip offers a density of 1 Gb (gigabit), allowing storage of large amounts of data in a compact form factor.2. High performance: With a fast read and program time, it provides efficient data access and programming capabilities. It also supports a wide range of operating frequencies for improved performance.3. Non-volatile memory: The chip uses NOR flash memory, which retains data even when power is removed. It provides reliable, instant-on storage, making it suitable for applications that require quick startup and data persistence.4. External memory interface: The chip supports a standard parallel interface, enabling easy integration with a wide range of microcontrollers and other devices.5. Advanced security features: It offers various security features like hardware block protection, secure code execution, and encrypted data storage, making it suitable for secure boot, firmware updates, and other applications where data integrity is crucial.Application scenarios:1. Industrial control systems: The S70FL01GSDPBHVC13 chip can be used for firmware storage and non-volatile parameter storage in various industrial applications, such as programmable logic controllers (PLCs), automation systems, and robotics.2. Automotive electronics: It can be employed in automotive applications like infotainment systems, instrument clusters, and advanced driver-assistance systems (ADAS) for storing firmware, configuration data, and logging information.3. Networking and telecommunications: The high density and performance make it suitable for networking equipment, such as routers, switches, and optical transport systems, where firmware storage and upgradeability are essential.4. Consumer electronics: The chip can be used in smart TVs, set-top boxes, gaming consoles, and other consumer electronics devices for storing firmware, operating systems, and application data.5. Internet of Things (IoT) devices: With its compact size and low power consumption, the chip is ideal for IoT devices, such as smart home products, wearables, and industrial sensors, where firmware storage, over-the-air updates, and data logging are required.It is important to note that while these advantages and application scenarios outline the versatility of the S70FL01GSDPBHVC13 chip, they are not exhaustive, and the chip may find use in various other systems and applications as well.
S70FL01GSDPBHVC13 Relevant information