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CY7C1011G30-12ZSXE

CY7C1011G30-12ZSXE

Manufacturer No:

CY7C1011G30-12ZSXE

Manufacturer:

Infineon Technologies

Description:

IC SRAM 2MBIT PARALLEL 44TSOP II

Datasheet:

Datasheet

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CY7C1011G30-12ZSXE Specifications

  • Type
    Parameter
  • Supplier Device Package
    44-TSOP II
  • Package / Case
    44-TSOP (0.400", 10.16mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    2.2V ~ 3.6V
  • Access Time
    10 ns
  • Write Cycle Time - Word, Page
    10ns
  • Memory Interface
    Parallel
  • Memory Organization
    128K x 16
  • Memory Size
    2Mbit
  • Technology
    SRAM - Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The CY7C1011G30-12ZSXE is a specific model of integrated circuit chip produced by Cypress Semiconductor. Some advantages and application scenarios of this chip are:1. Low power consumption: The chip is designed to operate at low power levels, making it suitable for applications where power efficiency is important. This can help extend the battery life of devices such as portable electronics or IoT devices.2. High performance: The chip is optimized for high-speed data transfer and processing, allowing it to handle complex tasks efficiently. It can be used in applications that require fast processing speeds and real-time data handling, such as networking equipment, industrial control systems, or multimedia devices.3. Large memory capacity: The chip has a large memory capacity, which can be advantageous in applications that require storage of large data sets or complex algorithms. It can be used in data storage devices, such as solid-state drives or memory cards, as well as in high-performance computing applications.4. Reliability: The chip is designed with built-in error checking and correction mechanisms, ensuring data integrity and reducing the risk of data corruption. This makes it suitable for applications where reliability is crucial, such as aerospace or medical devices.5. Broad compatibility: The chip is compatible with various industry-standard interfaces and protocols, making it versatile and easy to integrate into existing systems. It can be used in a wide range of applications, including communication systems, consumer electronics, automotive electronics, and more.Overall, the CY7C1011G30-12ZSXE integrated circuit chip offers low power consumption, high performance, large memory capacity, reliability, and broad compatibility, making it suitable for a variety of applications that require fast and efficient data processing, high memory capacity, and reliable operation.
CY7C1011G30-12ZSXE Relevant information