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S29GL01GS11FHIV13

S29GL01GS11FHIV13

Manufacturer No:

S29GL01GS11FHIV13

Manufacturer:

Infineon Technologies

Description:

IC FLASH 1GBIT PARALLEL 64FBGA

Datasheet:

Datasheet

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S29GL01GS11FHIV13 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-FBGA (13x11)
  • Package / Case
    64-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Access Time
    110 ns
  • Write Cycle Time - Word, Page
    60ns
  • Memory Interface
    Parallel
  • Memory Organization
    64M x 16
  • Memory Size
    1Gbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    GL-S
The S29GL01GS11FHIV13 integrated circuit chips, manufactured by Cypress Semiconductor, are high-density flash memory chips. Here are some advantages and application scenarios of these chips:Advantages: 1. High-density memory: The S29GL01GS11FHIV13 chip offers a storage capacity of 1 Gbit (128 MB), which is advantageous for applications requiring large amounts of non-volatile memory. 2. Fast read and write operations: These chips support high-speed read and write operations, allowing for quick access to data and efficient data storage. 3. Reliability: The chips have built-in error correction code (ECC) and endurance features, enhancing the reliability and longevity of the stored data. 4. Low power consumption: S29GL01GS11FHIV13 chips are designed to be power-efficient, making them suitable for battery-powered devices and reducing overall energy consumption. 5. Extended temperature range: These chips can operate reliably over a wide temperature range, making them suitable for applications in diverse environments.Application scenarios: 1. Embedded systems: The high density and fast read/write operations of these flash memory chips make them ideal for use in embedded systems such as industrial automation, automotive electronics, and IoT devices. 2. Solid-state drives (SSDs): S29GL01GS11FHIV13 chips can be used to build high-capacity and high-performance SSDs, which offer faster data access and greater durability compared to traditional hard disk drives (HDDs). 3. Networking devices: These chips can be used in routers, switches, and other networking equipment for data storage, firmware upgrades, and caching purposes. 4. Consumer electronics: The high-density flash memory is suitable for applications in digital cameras, smartphones, tablets, and other consumer electronic devices that require large storage capacity. 5. Medical devices: S29GL01GS11FHIV13 chips can be used in medical devices such as ultrasound machines, patient monitors, and medical record systems, where high-capacity storage and reliable data access are crucial.Please note that the specific suitability of these chips for an application may depend on the system requirements, and it is always advisable to consult the manufacturer's documentation and guidelines for accurate information.
S29GL01GS11FHIV13 Relevant information