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MX30UF4G18AC-XKI

MX30UF4G18AC-XKI

Manufacturer No:

MX30UF4G18AC-XKI

Manufacturer:

Macronix

Description:

IC FLASH 4GBIT PARALLEL 63VFBGA

Datasheet:

Datasheet

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Payment:

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MX30UF4G18AC-XKI Specifications

  • Type
    Parameter
  • Supplier Device Package
    63-VFBGA (9x11)
  • Package / Case
    63-VFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.7V ~ 1.95V
  • Access Time
    25 ns
  • Write Cycle Time - Word, Page
    25ns
  • Memory Interface
    Parallel
  • Memory Organization
    512M x 8
  • Memory Size
    4Gbit
  • Technology
    FLASH - NAND (SLC)
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    MX30UF
The MX30UF4G18AC-XKI integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-density memory: The MX30UF4G18AC-XKI chips offer a high-density memory of 4 gigabits (512 megabytes), allowing for storage of large amounts of data. 2. Low power consumption: These chips are designed to operate at low power, making them suitable for battery-powered devices and energy-efficient applications. 3. High-speed data transfer: The MX30UF4G18AC-XKI chips support high-speed data transfer rates, enabling quick and efficient data processing. 4. Reliable performance: These chips are built with advanced technology and undergo rigorous testing, ensuring reliable and stable performance. 5. Compact form factor: The MX30UF4G18AC-XKI chips are available in a compact form factor, making them suitable for space-constrained applications.Application scenarios: 1. Mobile devices: The high-density memory and low power consumption of MX30UF4G18AC-XKI chips make them ideal for use in smartphones, tablets, and other mobile devices. 2. Wearable technology: These chips can be used in smartwatches, fitness trackers, and other wearable devices that require high-density memory and low power consumption. 3. Internet of Things (IoT): MX30UF4G18AC-XKI chips can be used in IoT devices such as smart home appliances, industrial sensors, and connected devices, where low power consumption and high-speed data transfer are crucial. 4. Automotive electronics: These chips can be utilized in automotive applications like infotainment systems, advanced driver-assistance systems (ADAS), and in-vehicle networking, where reliable performance and high-density memory are required. 5. Industrial applications: MX30UF4G18AC-XKI chips can be used in industrial automation, robotics, and control systems that require high-speed data processing and reliable performance.Overall, the MX30UF4G18AC-XKI integrated circuit chips offer high-density memory, low power consumption, and reliable performance, making them suitable for a wide range of applications in various industries.
MX30UF4G18AC-XKI Relevant information