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CY62146EV30LL-45BVXI

CY62146EV30LL-45BVXI

Manufacturer No:

CY62146EV30LL-45BVXI

Manufacturer:

Infineon Technologies

Description:

IC SRAM 4MBIT PARALLEL 48VFBGA

Datasheet:

Datasheet

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CY62146EV30LL-45BVXI Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-VFBGA (6x8)
  • Package / Case
    48-VFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.2V ~ 3.6V
  • Access Time
    45 ns
  • Write Cycle Time - Word, Page
    45ns
  • Memory Interface
    Parallel
  • Memory Organization
    256K x 16
  • Memory Size
    4Mbit
  • Technology
    SRAM - Asynchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    MoBL®
CY62146EV30LL-45BVXI is a specific model of integrated circuit (IC) chip that belongs to the CY62146 series produced by Cypress Semiconductor. This chip offers several advantages and finds application in various scenarios:1. Low Power Consumption: The CY62146EV30LL-45BVXI is designed for low operating and standby power consumption. This makes it suitable for battery-powered devices, such as mobile phones, portable media players, and wearables, as it helps to optimize battery life.2. High Density: This IC chip has a high memory density, with a capacity of 16 megabits (2 megabytes). This enables it to store a substantial amount of information, making it suitable for memory-demanding applications like data logging, embedded systems, and automotive electronics.3. Fast Access and Low Latency: The CY62146EV30LL-45BVXI offers fast access times and low latency, ensuring quick retrieval and storage of data. This makes it ideal for applications that require high-speed data transfer, such as network switches, routers, and cache memory.4. Wide Operating Temperature Range: This IC chip is designed to operate across a wide temperature range, typically from -40°C to +85°C. This temperature tolerance allows it to function reliably in harsh environments, including automotive, industrial, and military applications.5. Small Package Size: The CY62146EV30LL-45BVXI is available in a small package size, such as the 48-ball VFBGA (Very Thin Fine-Pitch Ball Grid Array) package. This compact form factor facilitates its integration into space-constrained applications, including compact consumer electronics devices and IoT (Internet of Things) devices.In summary, the advantages of CY62146EV30LL-45BVXI IC chips include low power consumption, high density, fast access times, wide temperature tolerance, and small package size. These chips find application in battery-powered devices, memory-demanding applications, high-speed data transfer systems, harsh environments, and space-constrained devices.
CY62146EV30LL-45BVXI Relevant information