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S29GL256P10TFI013

S29GL256P10TFI013

Manufacturer No:

S29GL256P10TFI013

Manufacturer:

Infineon Technologies

Description:

IC FLASH 256MBIT PARALLEL 56TSOP

Datasheet:

Datasheet

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S29GL256P10TFI013 Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSOP
  • Package / Case
    56-TFSOP (0.724", 18.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Access Time
    100 ns
  • Write Cycle Time - Word, Page
    100ns
  • Memory Interface
    Parallel
  • Memory Organization
    32M x 8
  • Memory Size
    256Mbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    GL-P
The S29GL256P10TFI013 integrated circuit chip, manufactured by Cypress Semiconductor, is a high-performance, 256-megabit (32-megabyte) flash memory device. It offers several advantages and can be applied in various scenarios. Here are some key advantages and application scenarios:1. High Storage Capacity: The S29GL256P10TFI013 chip provides a large storage capacity of 256 megabits, which is equivalent to 32 megabytes. This makes it suitable for applications that require significant data storage, such as embedded systems, consumer electronics, and automotive applications.2. Fast Read and Write Operations: This flash memory chip offers fast read and write operations, enabling quick access to data. It has a fast page program time and a fast sector erase time, making it suitable for applications that require high-speed data transfer, such as solid-state drives (SSDs), digital cameras, and gaming consoles.3. Reliable and Durable: The S29GL256P10TFI013 chip is designed to be highly reliable and durable. It supports a minimum of 100,000 program/erase cycles, ensuring a long lifespan. This reliability makes it suitable for applications that require frequent data updates, such as industrial control systems, medical devices, and networking equipment.4. Wide Temperature Range: This chip is designed to operate over a wide temperature range, typically from -40°C to +85°C. This makes it suitable for applications that require operation in extreme temperature conditions, such as automotive electronics, aerospace systems, and outdoor industrial equipment.5. Compatibility and Integration: The S29GL256P10TFI013 chip is compatible with standard flash memory interfaces, making it easy to integrate into existing systems. It supports common protocols like SPI (Serial Peripheral Interface) and parallel interfaces, allowing for seamless integration into various applications.Application scenarios for the S29GL256P10TFI013 chip include but are not limited to:- Embedded Systems: The chip can be used in embedded systems for storing firmware, boot code, and configuration data.- Consumer Electronics: It can be utilized in devices like digital cameras, set-top boxes, and portable media players for data storage and firmware updates.- Automotive Applications: The chip can be employed in automotive electronics for storing maps, firmware, and other critical data.- Industrial Control Systems: It can be used in industrial control systems for storing program code, configuration data, and logging information.- Networking Equipment: The chip can be utilized in routers, switches, and other networking equipment for storing firmware, configuration data, and logging information.These are just a few examples of the advantages and application scenarios of the S29GL256P10TFI013 integrated circuit chip. Its versatility, reliability, and high storage capacity make it a suitable choice for a wide range of applications requiring non-volatile memory.
S29GL256P10TFI013 Relevant information