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MT53E384M32D2DS-053 AAT:E

MT53E384M32D2DS-053 AAT:E

Manufacturer No:

MT53E384M32D2DS-053 AAT:E

Manufacturer:

Micron Technology Inc.

Description:

IC DRAM 12GBIT 1.866GHZ 200WFBGA

Datasheet:

Datasheet

Delivery:

Payment:

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MT53E384M32D2DS-053 AAT:E Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    200-WFBGA (10x14.5)
  • Package / Case
    200-WFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 105°C (TC)
  • Voltage - Supply
    1.1V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    1.866 GHz
  • Memory Interface
    -
  • Memory Organization
    384M x 32
  • Memory Size
    12Gbit
  • Technology
    SDRAM - Mobile LPDDR4
  • Memory Format
    DRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The MT53E384M32D2DS-053 AAT:E integrated circuit chips have several advantages and application scenarios. These include:Advantages: 1. High Density: These chips offer a high-density storage capacity of 32 gigabits (Gb), allowing for the storage of a large amount of data in a small form factor. 2. High Speed: The chips provide fast data transfer rates, enabling quick access to stored information. 3. Low Power Consumption: They are designed to operate with low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 4. Compact Form Factor: The chips come in a small and compact package, which is beneficial for space-constrained designs and portable devices. 5. Reliable Performance: They offer a high level of reliability and durability, ensuring long-term performance and data integrity.Application Scenarios: 1. Smartphones and Tablets: Due to their high-density storage and low power consumption, these chips are commonly used in smartphones and tablets to store large amounts of data, such as apps, multimedia files, and operating system software. 2. Wearable Devices: The compact form factor and low power consumption of these chips make them suitable for use in wearable devices, such as smartwatches, fitness trackers, and augmented reality glasses. 3. Automotive Electronics: The chips can be employed in automotive electronics for data storage, including infotainment systems, navigation systems, and advanced driver-assistance systems (ADAS). 4. Embedded Systems: They find application in embedded systems, like industrial automation, Internet of Things (IoT) devices, and medical equipment, where high-density storage is required within limited space. 5. Data Centers and Cloud Computing: These chips can be used in servers and data centers to provide high-capacity and fast storage for cloud computing applications, including virtualization, data analytics, and artificial intelligence.Overall, the MT53E384M32D2DS-053 AAT:E integrated circuit chips offer high-density and high-speed storage with low power consumption, making them suitable for various applications that require efficient data storage, retrieval, and processing.
MT53E384M32D2DS-053 AAT:E Relevant information