FEMC016GBG-T340

FEMC016GBG-T340

Manufacturer No:

FEMC016GBG-T340

Manufacturer:

Flexxon Pte Ltd

Description:

IC FLASH 128GBIT EMMC 153FBGA

Datasheet:

Datasheet

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FEMC016GBG-T340 Specifications

  • Type
    Parameter
  • Clock Frequency
    200 MHz
  • Supplier Device Package
    153-FBGA (11.5x13)
  • Package / Case
    153-VFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -25°C ~ 85°C
  • Voltage - Supply
    2.7V ~ 3.6V
  • Access Time
    -
  • Write Cycle Time - Word, Page
    -
  • Memory Interface
    eMMC
  • Memory Organization
    16G x 8
  • Memory Size
    128Gbit
  • Technology
    FLASH - NAND (TLC)
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    XTRA V
The FEMC016GBG-T340 is an integrated circuit chip designed for power amplification in 5G wireless communication systems. Here are some advantages and application scenarios of this chip:Advantages: 1. High Efficiency: The chip offers high power-added efficiency (PAE), which improves overall energy efficiency in power amplification, resulting in reduced power consumption. 2. Compact Size: The chip's small form factor allows for easy integration into various wireless devices, such as smartphones, tablets, and IoT devices. 3. Broadband Operation: It supports a wide frequency range, making it suitable for multiple 5G frequency bands and allowing for versatile application scenarios. 4. High Linearity: The chip provides linear power amplification, enabling better signal integrity and minimizing distortion. 5. Excellent RF Performance: It delivers high output power and good gain, meeting the demanding requirements of 5G communication systems.Application Scenarios: 1. 5G Smartphones: The chip can be used in the power amplifier module of 5G smartphones to enhance their signal strength and coverage while maintaining efficient power usage. 2. IoT Devices: With its compact size and high efficiency, the chip is ideal for integrating into small IoT devices, enabling reliable and efficient wireless communication in smart homes, wearables, and other IoT applications. 3. 5G Base Stations: The chip's broad frequency range and high linearity make it suitable for use in power amplifiers of 5G base stations, ensuring optimal coverage and signal quality over a wide area. 4. Mobile Hotspots: The chip can be utilized in power amplifiers for portable 5G mobile hotspots, offering users high-speed and reliable internet connectivity on the go. 5. Telecommunications Infrastructure: This chip can be applied in various telecommunication infrastructure equipment, such as repeaters, picocells, and femtocells, to enhance the signal strength and capacity of 5G networks.Overall, the FEMC016GBG-T340 chip is designed to optimize power amplification in 5G wireless communication systems, delivering high efficiency, compact size, and excellent RF performance in various application scenarios.