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23LCV1024-I/P

23LCV1024-I/P

Manufacturer No:

23LCV1024-I/P

Manufacturer:

Microchip Technology

Description:

IC SRAM 1MBIT SPI/DUAL 8DIP

Datasheet:

Datasheet

Delivery:

Payment:

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23LCV1024-I/P Specifications

  • Type
    Parameter
  • Access Time
    -
  • Supplier Device Package
    8-PDIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.5V ~ 5.5V
  • Write Cycle Time - Word, Page
    -
  • Clock Frequency
    20 MHz
  • Memory Interface
    SPI - Dual I/O
  • Memory Organization
    128K x 8
  • Memory Size
    1Mbit
  • Technology
    SRAM - Synchronous
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The IS43TR16512BL-125KBL is an integrated circuit chip, specifically a 16Gb DDR3L SDRAM chip, manufactured by Integrated Silicon Solution Inc. (ISSI). Here are the advantages and application scenarios of this chip:1. High capacity: The chip has a capacity of 16Gb, making it suitable for applications that require large memory capacity, such as high-performance computing, data centers, networking equipment, and high-end consumer electronics.2. Low power consumption: The DDR3L interface of the chip allows for lower power consumption compared to the previous DDR3 standard. This makes it ideal for portable devices, IoT devices, and any application that requires energy efficiency.3. Fast data transfer rates: The DDR3L interface also enables higher data transfer rates, providing better performance for memory-intensive applications like video processing, gaming, and AI/ML algorithms.4. Wide temperature range: The IS43TR16512BL-125KBL chip has an extended industrial temperature range of -40°C to +95°C, making it suitable for harsh operating environments, including automotive, aerospace, and industrial applications.5. Easy integration: The chip is offered in a small form factor and is compatible with standard DDR3L interfaces, allowing for easy integration into existing system designs.Application scenarios:1. Computer systems: The chip can be used in desktops, laptops, and servers to provide high-performance memory for demanding computational tasks or virtualization environments.2. Networking equipment: The chip can be utilized in routers, switches, and network appliances to handle high-speed data processing and packet routing.3. Data storage systems: With its large capacity and fast data transfer rates, the chip can be used in solid-state drives (SSDs) or other storage devices to improve data access speeds and overall system performance.4. Automotive electronics: The extended temperature range of the chip makes it suitable for use in automotive applications, such as infotainment systems, advanced driver-assistance systems (ADAS), or in-vehicle networking.5. Industrial automation: The chip can withstand harsh operating conditions and provide reliable memory for industrial control systems, robotics, and other automation applications.In summary, the IS43TR16512BL-125KBL chip offers high capacity, low power consumption, fast data transfer rates, and wide temperature range, making it suitable for a wide range of applications that require large memory capacity, energy efficiency, and reliability in demanding environments.
23LCV1024-I/P Relevant information