S29AL016J55TFIR20

S29AL016J55TFIR20

Manufacturer No:

S29AL016J55TFIR20

Manufacturer:

Infineon Technologies

Description:

IC FLASH 16MBIT PARALLEL 48TSOP

Datasheet:

Datasheet

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S29AL016J55TFIR20 Specifications

  • Type
    Parameter
  • Access Time
    55 ns
  • Supplier Device Package
    48-TSOP
  • Package / Case
    48-TFSOP (0.724", 18.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    3V ~ 3.6V
  • Write Cycle Time - Word, Page
    55ns
  • Memory Interface
    Parallel
  • Memory Organization
    2M x 8, 1M x 16
  • Memory Size
    16Mbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    AL-J
The 71V3556S133PFG integrated circuit chip is a synchronous pipelined burst SRAM (Static Random Access Memory) manufactured by IDT (Integrated Device Technology). Some of its advantages and application scenarios are:Advantages: 1. High-density memory: The chip offers a storage capacity of 4 Megabits (256K x16) in a single device, making it suitable for applications requiring significant memory capacity. 2. Fast operation: It supports synchronous pipelined burst access, which provides high-speed access to memory. The chip has a synchronous clock with a burst cycle of 2 clocks, enabling quick data transfers. 3. Low power consumption: The 71V3556S133PFG is designed to be power-efficient, making it suitable for battery-powered devices or applications where power consumption is a concern. 4. Voltage compatible: The chip operates at a standard voltage range of 3.3V, allowing for easy integration into existing systems or devices. 5. Easy interface: It uses a simple interface with controlled data inputs and outputs, making it user-friendly and easy to interface with other microcontrollers or processors.Application scenarios: 1. Data storage: The high-density memory capacity of the chip makes it suitable for use in data storage applications, such as buffering or caching large amounts of data. 2. Embedded systems: The chip can be used in embedded systems or microcontroller-based applications, where fast and reliable memory access is required to store program code or data. 3. Networking equipment: The chip's high-speed operation and efficient memory utilization make it suitable for networking devices, such as routers or switches, where fast data processing and buffering are essential. 4. Telecommunications: It can be used in communication systems, such as base stations or network switches, where high-speed memory access is required for data buffering or packet processing. 5. Industrial control systems: The robust design and low power consumption of the chip make it suitable for use in industrial control systems, where long-term memory storage and reliable operation are critical.It is important to note that the specific application scenarios may vary depending on the requirements of the system and the overall architecture.