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RMLV0816BGSB-4S2#HA0

RMLV0816BGSB-4S2#HA0

Manufacturer No:

RMLV0816BGSB-4S2#HA0

Description:

IC SRAM 8MBIT PARALLEL 44TSOP II

Datasheet:

Datasheet

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RMLV0816BGSB-4S2#HA0 Specifications

  • Type
    Parameter
  • Supplier Device Package
    44-TSOP II
  • Package / Case
    44-TSOP (0.400", 10.16mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.4V ~ 3.6V
  • Access Time
    45 ns
  • Write Cycle Time - Word, Page
    45ns
  • Memory Interface
    Parallel
  • Memory Organization
    512K x 16
  • Memory Size
    8Mbit
  • Technology
    SRAM
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The RMLV0816BGSB-4S2#HA0 integrated circuit (IC) chips offer several advantages and can be used in various application scenarios:1. High Density: These IC chips have a high density of 512Mb, which means they can store a large amount of data in a compact form factor. This makes them suitable for applications requiring high memory capacity.2. Speed: The RMLV0816BGSB-4S2#HA0 chips have a fast access time, enabling efficient and quick data retrieval. This property is advantageous for applications that require fast and real-time data access.3. Low Power Consumption: These IC chips are designed to consume low power during operation, making them suitable for battery-operated devices or power-constrained applications. This characteristic helps in extending the battery life and reducing energy consumption.4. Wide Voltage Range: The RMLV0816BGSB-4S2#HA0 chips function within a wide voltage range, allowing them to work with different power supply systems. This versatility is beneficial for applications that operate in various voltage levels.5. Industrial Grade: These IC chips are built to withstand harsh environmental conditions, making them suitable for use in industrial applications. They have robust design features, like resistance to high temperatures, voltage fluctuations, and electromagnetic interference.Application scenarios for RMLV0816BGSB-4S2#HA0 IC chips include:1. Mobile Devices: These chips can be used in smartphones, tablets, and other portable devices to provide high-capacity memory for storing data, such as multimedia files, applications, and user data.2. Networking Equipment: RMLV0816BGSB-4S2#HA0 chips can be employed in routers, switches, and network storage devices to enhance their data processing and storage capabilities.3. Automotive Electronics: These IC chips can be utilized in automotive infotainment systems, navigation systems, and advanced driver-assistance systems, where high-density memory is required to store large amounts of data.4. Industrial Control Systems: These chips are well-suited for industrial automation applications, where they can store process data and provide fast access to control algorithms.5. Medical Devices: RMLV0816BGSB-4S2#HA0 chips can be integrated into medical devices like imaging equipment, patient monitoring systems, and wearable devices, to store and process large volumes of medical data.These are just a few examples, and the versatility of RMLV0816BGSB-4S2#HA0 IC chips allows them to be utilized in several other applications requiring high-density, low-power memory solutions.
RMLV0816BGSB-4S2#HA0 Relevant information