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S29GL01GS12TFIV10

S29GL01GS12TFIV10

Manufacturer No:

S29GL01GS12TFIV10

Manufacturer:

Infineon Technologies

Description:

IC FLASH 1GBIT PARALLEL 56TSOP

Datasheet:

Datasheet

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S29GL01GS12TFIV10 Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-TSOP
  • Package / Case
    56-TFSOP (0.724", 18.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Access Time
    120 ns
  • Write Cycle Time - Word, Page
    60ns
  • Memory Interface
    Parallel
  • Memory Organization
    64M x 16
  • Memory Size
    1Gbit
  • Technology
    FLASH - NOR
  • Memory Format
    FLASH
  • Memory Type
    Non-Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    GL-S
The S29GL01GS12TFIV10 integrated circuit (IC) chips, manufactured by Cypress Semiconductor, offer several advantages and find application in various scenarios. Here are some of the advantages and potential application scenarios for these chips:Advantages: 1. High Density: These chips have a high density of 1Gb, allowing for large amounts of data storage on a single chip. 2. Fast Read and Write Speeds: The S29GL01GS12TFIV10 chips offer fast read and write speeds, enabling efficient data transfer and processing. 3. Reliability: These chips are designed to provide high reliability and endurance, making them suitable for applications that require frequent data writes or long-term storage. 4. Advanced Security Features: The integrated circuit chips include advanced security features like hardware and/or software protection mechanisms, ensuring the confidentiality and integrity of stored data. 5. Low Power Consumption: These chips are engineered to consume low power, making them suitable for battery-powered devices and applications where power efficiency is critical. 6. Wide Temperature Range: The S29GL01GS12TFIV10 chips can operate within a wide temperature range, making them suitable for use in extreme environmental conditions.Application Scenarios: 1. Data Storage and Retrieval: These chips can be used in various data storage applications, such as solid-state drives (SSDs), USB flash drives, and memory cards, where high-density and reliable data storage is required. 2. Automotive Electronics: With their high reliability and wide temperature range, these chips can be used in automotive systems for applications like infotainment systems, instrument clusters, and advanced driver assistance systems (ADAS). 3. Industrial Control Systems: The S29GL01GS12TFIV10 chips can be utilized in industrial control systems and automation applications that require fast and reliable data storage, such as programmable logic controllers (PLCs), human-machine interfaces (HMIs), and robotics. 4. Networking and Telecommunications: These chips can be used in networking and telecommunications systems for applications like routers, switches, network storage devices, and high-speed data communication equipment. 5. Aerospace and Defense: The high reliability and advanced security features make the S29GL01GS12TFIV10 chips suitable for aerospace and defense applications that require secure data storage, such as avionics systems and military equipment.It is important to note that the specific application scenarios may vary based on the requirements of the end-product and the capabilities of the surrounding system.
S29GL01GS12TFIV10 Relevant information