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RMLV0408EGSB-4S2#AA1

RMLV0408EGSB-4S2#AA1

Manufacturer No:

RMLV0408EGSB-4S2#AA1

Description:

IC SRAM 4MBIT PARALLEL 32TSOP II

Datasheet:

Datasheet

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RMLV0408EGSB-4S2#AA1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-TSOP II
  • Package / Case
    32-SOIC (0.400", 10.16mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Access Time
    45 ns
  • Write Cycle Time - Word, Page
    45ns
  • Memory Interface
    Parallel
  • Memory Organization
    512K x 8
  • Memory Size
    4Mbit
  • Technology
    SRAM
  • Memory Format
    SRAM
  • Memory Type
    Volatile
  • DigiKey Programmable
    Not Verified
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The RMLV0408EGSB-4S2#AA1 integrated circuit chips have the following advantages and application scenarios:Advantages: 1. High Density: These chips offer a high density of 4M words x 8 bits, providing ample storage capacity for various applications. 2. Low Power Consumption: The chips are designed to operate with low power consumption, making them suitable for battery-powered devices or energy-efficient applications. 3. Wide Voltage Range: They support a wide voltage range, making them compatible with diverse systems and offering flexibility in implementation. 4. High Speed: The chips have fast access times, enabling quick data retrieval and processing, suiting them for applications that require real-time or high-speed operations. 5. Non-Volatile Memory: These chips utilize non-volatile memory technology, allowing data to be retained even when the power is disconnected.Application Scenarios: 1. Data Storage: The RMLV0408EGSB-4S2#AA1 chips can be used in various data storage applications, such as embedded systems, portable devices (e.g., handheld devices, digital cameras), and industrial equipment (e.g., data loggers, smart meters). 2. Automotive Electronics: The chips are suitable for automotive applications that require reliable and high-density memory storage, such as infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs). 3. Industrial Control Systems: These chips can be used in industrial control systems, where high-speed and non-volatile memory are required for data buffering, storing configuration settings, and logging process data. 4. Medical Devices: The chips can be utilized in medical devices like patient monitoring systems, bioinformatics instruments, and diagnostic equipment, where high-density memory is crucial for storing patient data and processing medical information. 5. IoT (Internet of Things): With their low power consumption and wide voltage range, the chips can be integrated into IoT devices and sensors that rely on efficient power utilization and need to store and process data locally.Note: The specific advantages and application scenarios may vary depending on the manufacturer's specifications and intended usage. It is advisable to refer to the datasheet or consult the manufacturer for precise details.
RMLV0408EGSB-4S2#AA1 Relevant information